| Allicdata Part #: | ATS-13E-12-C1-R0-ND |
| Manufacturer Part#: |
ATS-13E-12-C1-R0 |
| Price: | $ 3.48 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13E-12-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.16197 |
| 30 +: | $ 3.07671 |
| 50 +: | $ 2.90581 |
| 100 +: | $ 2.73489 |
| 250 +: | $ 2.56397 |
| 500 +: | $ 2.47851 |
| 1000 +: | $ 2.22211 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential discipline when designing most electronic components. As components are increasingly more powerful and operate at high temperatures, efficient and reliable cooling solutions are an integral part of the design process. Heat sinks, also called heat spreaders, are used to safely dissipate heat away from components and allow them to work optimally. The ATS-13E-12-C1-R0 heat sink is a highly efficient and reliable solution for dissipating heat in a wide range of applications.
Features and Benefits
The ATS-13E-12-C1-R0 is a lightweight aluminum heat sink that weighs just 4.36 lbs. It is 12” in diameter and is easily integrated into most applications. It features a unique design that allows for greater heat transfer from the component to the heat sink. This reduces component temperature and prolongs the life of sensitive components. It also offers excellent thermal management performance even under the most demanding conditions.
In addition, the ATS-13E-12-C1-R0 is designed to be simple to install and requires no special tools. It is possible to mount the device using standard screws and brackets and it is suitable for a wide range of situations. The device features a robust construction that ensures reliable heat dissipation and allows it to be used in most demanding applications.
Applications
The ATS-13E-12-C1-R0 is well suited for a variety of applications in commercial, industrial, and residential settings. It is often used to dissipate heat generated from electronic components, such as power amplifiers, power supplies, computer processors, telecommunications equipment, and medical instrumentation. Often, these components are located in small, confined spaces and the ATS-13E-12-C1-R0 is designed to be a suitable size for such locations. Additionally, the device is suitable for cooling components in vehicles, industrial machines, manufacturing processes, and other sensitive applications.
Working Principle
The working principle of the ATS-13E-12-C1-R0 is relatively straightforward. The device is composed of aluminum which is an excellent thermal conductor. It is designed to allow heat from the component to be transferred to the heat sink where it is spread by theradiation and convection processes. This allows for more effective heat dissipation which helps to reduce temperatures in the component and prolongs its life. Additionally, the aluminum fins are designed to be linked in an efficient manner allowing for more efficient heat transfer.
Conclusion
All in all, the ATS-13E-12-C1-R0 is a highly effective and reliable heat sink solution. It is designed to be easy to install and offers excellent thermal performance in a range of applications. The unique design allows for greater heat transfer from the component to the device, ensuring optimum cooling efficiency. If you\'re looking for an efficient cooling solution for your electronic components, the ATS-13E-12-C1-R0 is the perfect choice.
The specific data is subject to PDF, and the above content is for reference