| Allicdata Part #: | ATS-13E-145-C3-R0-ND |
| Manufacturer Part#: |
ATS-13E-145-C3-R0 |
| Price: | $ 3.79 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13E-145-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.44673 |
| 30 +: | $ 3.25542 |
| 50 +: | $ 3.06394 |
| 100 +: | $ 2.87242 |
| 250 +: | $ 2.68093 |
| 500 +: | $ 2.48943 |
| 1000 +: | $ 2.44156 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.91°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
The ATS-13E-145-C3-R0 is an efficient heat sink designed for high performance applications. It is well suited for high-end microprocessors, RF and other high-power devices, as well as power management components. It features a patented aluminum baseplate design that provides excellent thermal dissipation and heat transfer capability.
When operating correctly, the ATS-13E-145-C3-R0 offers several advantages. It can reduce heat-source temperatures up to 20-50 degrees Celsius (36-90 Fahrenheit) while maintaining a low noise level. Additionally, its compact design means it can easily fit into tight spaces, such as laptops and portable devices. As it is made from alloys, this design is also corrosion-resistant, making it durable over time.
Application Field
The ATS-13E-145-C3-R0 is a high-performance heat sink ideal for a wide variety of applications. It is particularly useful for electronic components that dissipate a large amount of heat, such as microprocessors, RF, and other high-power electronics. It can also be used for power management components, such as power circuits, regulators, and converters.
Working Principle
The ATS-13E-145-C3-R0 works by dissipating heat away from high-power components. The aluminum baseplate design helps to transfer heat away from the heat source, taking advantage of natural thermal convection to reduce the temperature of the component. The aluminum also helps to reduce noise levels, allowing for quieter operation. The heat sink\'s screw holes are designed to fit standard mounting systems, allowing it to be easily attached to components.
The ATS-13E-145-C3-R0 is designed to dissipate the most amount of heat with the least noise possible. It uses a quiet, low-profile aluminum design to reduce heat-source temperatures, allowing it to keep the component running smoothly. In addition, its small size helps to save space, making it useful for applications in tight spaces. The ATS-13E-145-C3-R0 is an efficient and reliable solution for any high-power component cooling needs.
The specific data is subject to PDF, and the above content is for reference