| Allicdata Part #: | ATS-13E-148-C1-R0-ND |
| Manufacturer Part#: |
ATS-13E-148-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X15MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13E-148-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.56°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks serve an important purpose in engineering; they dissipate heat quickly and efficiently, protecting components and other electronics from damage due to overheating. ATS-13E-148-C1-R0 is an innovative product that falls under the thermal - heat sink category. It is highly versatile and is suitable for a wide range of applications.
A thermal - heat sink is simply a device that dissipates heat away from other components or materials by transferring it away from the surface. This transfer is typically carried out with the use of air, liquid, or solid materials. ATS-13E-148-C1-R0 utilizes liquid as its thermal interface material for a maximum cooling effect. Its high thermal conductivity dissipates heat quickly while increasing the airflow to ensure efficient cooling.
The ATS-13E-148-C1-R0 features a unique the three-layer construction. The construction consists of a top layer of PTFE (polytetrafluoroethylene) material, a central ring of aluminum, and a bottom layer of polycarbonate material. The PTFE layer is designed to reduce conduction of heat and provide a layer of insulation to the components below it, while the aluminum layer acts as the heat spreader. Finally, the polycarbonate layer provides a base with excellent adhesion and mechanical strength.
The ATS-13E-148-C1-R0 is ideal for cooling electronics in applications such as commercial, industrial, medical, military, and consumer electronics. Its self-adhesive top layer and low-profile design make it an ideal solution for applications with space constraints. The PTFE layer is highly resistant to solvents and abrasives, and it can easily be cut to fit the desired dimensions. Additionally, the combination of aluminum and polycarbonate materials increases the thermal conductivity of the device, allowing it to dissipate heat quickly.
In addition to its ease of use and high thermal conductivity, the ATS-13E-148-C1-R0 also features an IP 65 rating. This rating ensures that the device is water and dust resistant, making it ideal for outdoor applications. Its lightweight design also allows it to be used in locations where weight is an issue. Furthermore, its high IPC (immersion coefficient protection) rating ensures that it can withstand immersion in liquid for extended periods of time.
The ATS-13E-148-C1-R0 offers superior performance for any application that requires efficient cooling. Its unique three-layer construction and high IP rating make it an ideal choice for a variety of applications. Its low-profile design and self-adhesive top layer make it easy to install in tight spaces, while its lightweight design makes it easy to transport. Its excellent thermal conductivity makes it a great choice for applications where heat dissipation is critical.
The specific data is subject to PDF, and the above content is for reference