| Allicdata Part #: | ATS-13E-165-C1-R0-ND |
| Manufacturer Part#: |
ATS-13E-165-C1-R0 |
| Price: | $ 3.01 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13E-165-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.71026 |
| 30 +: | $ 2.63718 |
| 50 +: | $ 2.49077 |
| 100 +: | $ 2.34423 |
| 250 +: | $ 2.19769 |
| 500 +: | $ 2.12444 |
| 1000 +: | $ 1.90466 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-13E-165-C1-R0 is a thermal - heat sink designed for use in a range of applications. It is a very efficient way of dissipating heat from electronic components, and is designed to provide excellent thermal performance.
The ATS-13E-165-C1-R0 features an aluminum baseplate, which is designed to help dissipate heat efficiently, while also providing a rigid support for components. The baseplate features integral fins which act as a high surface area dissipater for greater thermal performance. The fins can also be customized to match specific design requirements.
The ATS-13E-165-C1-R0 also features an innovative cooling design, which uses thermally conductive elastomer to ensure that the heat is spread evenly and efficiently across the surface area. This ensures that all parts of the device remain at an optimal temperature, even when operating at high power levels.
The heat is then further dissipated to the environment through air-flow. This can be accomplished through forced air-cooling or simple natural convection. For higher power applications, forced air-cooling is recommended, as it can offer greater levels of efficiency.
The finished product is designed to be very lightweight and compact, yet still provide excellent thermo-mechanical performance. It can be used in desktop and server applications, as well as in consumer electronics, telecommunications and other industries. The ATS-13E-165-C1-R0 is also extensively used in the automotive industry, for both emitting and dissipating heat from current components.
Overall, the ATS-13E-165-C1-R0 offers a reliable and effective way to keep the temperature of electronic components at a stable, optimal level. It offers excellent thermal management, and is extremely lightweight and compact, making it the ideal thermal - heat sink solution for a wide range of applications.
The specific data is subject to PDF, and the above content is for reference