Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	9.03°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks: ATS-13E-167-C1-R0 Application Field and Working Principle

Heat sinks are electrical components that absorb, transfer and dissipate heat generated by electronics. They are typically made out of metal that is thermally conductive and also have a large surface area in order to dissipate the heat faster. The ATS-13E-167-C1-R0 is a type of heat sink that is designed to dissipate heat generated by large-scale electronic components, such as chipsets and processors, and is commonly used in telecommunications, aerospace, automotive and other high-powered electronic devices.

Application Field

The ATS-13E-167-C1-R0 heat sink is designed to dissipate heat generated by large-scale electronic components. It is used in telecommunications, aerospace, automotive and industrial equipment. It is ideally suited for applications that require a highly efficient thermal solution that is capable of providing a lower operating temperature.

Design

The ATS-13E-167-C1-R0 heat sink consists of an extruded aluminum base featuring a finned top design that maximizes the surface area of the heat sink for dissipating heat. The base is also coated with a corrosion resistant nickel finish to increase durability and lifespan. In addition, there are two captive screws at the bottom of the heat sink that allow for easy mounting onto a PCB or other heat-generating electronic component. The bottom surface of the heat sink also features a thermal pad to provide an additional layer of thermal transfer.

Working Principle

The ATS-13E-167-C1-R0 heat sink works on a simple principle. Heat is generated from the electronic component it is mounted on and the thermal pad on the bottom of the heat sink helps transfer the heat from the component into the finned aluminum structure. The heat is then dissipated from the finned aluminum structure into the surrounding environment via convection.

Benefits

The ATS-13E-167-C1-R0 thermal solution offers a number of advantages over traditional heat sinks. It is lightweight and takes up less space than traditional heat sinks, making it easier to install. It also features a corrosion-resistant nickel finish that increases the heat sink’s durability and lifespan. In addition, the finned top design optimizes the surface area of the heat sink, allowing for more efficient heat transfer and less thermal loss.

Conclusion

The ATS-13E-167-C1-R0 is an efficient thermal solution that is designed to dissipate heat generated by large-scale electronic components, such as chipsets and processors. It is lightweight, takes up less space and offers an optimized finned top design for superior heat transfer. In addition, the heat sink features a corrosion-resistant nickel finish for increased durability and lifespan. Overall, the ATS-13E-167-C1-R0 is a great choice for anyone looking for a reliable and efficient thermal solution.

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