ATS-13E-168-C2-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are essential components in today’s electronics industries. They are designed to provide effective cooling of electronic components, such as CPUs, GPUs, and other processors. Thermal management solutions are critical for optimal performance, reliability, and longevity of these components. The ATS-13E-168-C2-R0 is a thermal – heat sink solution designed for cooling of components in tough applications, such as high-duty military and aerospace applications.

The ATS-13E-168-C2-R0 is the latest in a long line of high-performance heat sinks from AvioTech Systems. This solution has been designed with superior efficiency for all high-power applications. The ATS-13E-168-C2-R0 incorporates a precision-tuned fin array that provides exceptional levels of heat dissipation and high thermal conductivity. This ensures that components receive a higher level of cooling regardless of their operating environment.

The ATS-13E-168-C2-R0 heat sink uses a patent-pending liquid-to-air heat exchanger to provide additional thermal benefits. With the help of the heat exchanger, the heat from the liquid can be conducted away from the component, reducing the component’s temperature by several degrees Celsius. This heat exchanger also helps to prevent the components from being damaged due to excess heat. Furthermore, the adiabatic properties of the heat exchanger allow for effective cooling even in smaller or confined spaces.

The ATS-13E-168-C2-R0 is also designed to meet the stringent thermal management requirements of the highest standards of military and aerospace applications. The robust construction and design ensure that the ATS-13E-168-C2-R0 performs reliably in high-duty environments. All of the materials used in the ATS-13E-168-C2-R0 are specially selected for their ability to provide superior thermal resistance and durability. Furthermore, the combination of the fins and heat exchanger ensures that there will be no hot spots on the component, thus reducing the risk of component failure.

To maintain performance, the ATS-13E-168-C2-R0 heat sink utilizes a variety of technologies, including active air cooling, liquid cooling, and forced convection. Active air cooling is achieved by the use of a fan to draw heat away from the component. Liquid cooling uses a cooling liquid, such as water or oil, to help provide effective thermal management for the component. Forced convection is the process of drawing heat away from a component using a blower. This helps to reduce the overall temperature of the component while also increasing the life span of the component.

In addition to providing superior cooling, the ATS-13E-168-C2-R0 thermal – heat sink solution also helps to reduce noise levels. The environmentally friendly material used for the heat exchange provides great sound dampening qualities, allowing for quiet operation. Furthermore, the robust design ensures that the heat sink will remain effective for a long period of time without the need for maintenance. With all of these features, the ATS-13E-168-C2-R0 is an ideal solution for any application requiring cooling.

The specific data is subject to PDF, and the above content is for reference