| Allicdata Part #: | ATS-13E-170-C3-R0-ND |
| Manufacturer Part#: |
ATS-13E-170-C3-R0 |
| Price: | $ 3.66 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13E-170-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.32892 |
| 30 +: | $ 3.23862 |
| 50 +: | $ 3.05878 |
| 100 +: | $ 2.87885 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.60896 |
| 1000 +: | $ 2.33906 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are frequently used for cooling components in electronic devices with high thermal output. The ATS-13E-170-C3-R0 is a specialized heat sink designed to quickly and effectively dissipate heat. With an efficient air-flow design, this heat sink is an ideal choice for a wide range of applications in electronics.
Application Field
The ATS-13E-170-C3-R0 is primarily designed for use in cooling electronic components with high output temperatures. It is also suitable for applications in medical device electronics, industrial and automotive electronics, LEDs and other lighting, solar energy and other thermal energy conversion, and environmental monitoring.
Working Principle
The working principle of the ATS-13E-170-C3-R0 is based on the fact that hot air rises. As air flows across the finned surface of the heat sink, the rate of cooling is increased due to convection, resulting in the heat being dissipated quickly. This air flow is greatly enhanced by the design of the unit, which features an aerodynamic shape and precise fin spacing, allowing for greater air flow and improved cooling performance.
The ATS-13E-170-C3-R0 also features advanced thermal design elements such as a dual-layer protective grille, which improves the efficiency of the cooling system and provide greater protection against dust and debris. This heat sink also includes an aluminum base for improved heat dissipation.
Benefit
The ATS-13E-170-C3-R0 is a highly efficient heat sink that has excellent thermal performance for electronics and electrical components. The aerodynamic design allows for increased air flow and improved cooling efficiency. The dual-layer protective grille and aluminum base provide additional protection against dust and debris, ensuring reliable and durable cooling performance.
The heat sink is compact, lightweight, and easy to install, making it an ideal choice for a wide range of applications. The ATS-13E-170-C3-R0 is a high quality, reliable heat sink that is designed for superior cooling performance.
The specific data is subject to PDF, and the above content is for reference