| Allicdata Part #: | ATS22543-ND |
| Manufacturer Part#: |
ATS-13E-184-C2-R0 |
| Price: | $ 4.44 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13E-184-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.03200 |
| 10 +: | $ 3.92112 |
| 25 +: | $ 3.70339 |
| 50 +: | $ 3.48541 |
| 100 +: | $ 3.26762 |
| 250 +: | $ 3.04978 |
| 500 +: | $ 2.83194 |
| 1000 +: | $ 2.77748 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.14°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are a great option for electronics engineers looking to cool their components and systems. The ATS-13E-184-C2-R0 heat sink is a great example of such a product, offering a number of benefits and features. Here we will look at the application field and working principle of this heat sink.
This heat sink is designed for use in microprocessor applications and other high power electronics. It has an effective dissipation area of 184 square inches, making it ideal for cooling microprocessors and similar components. The heat sink is constructed from aluminum and is made up of four bent fins that provide an effective area for spreading heat. The fins are designed to maximize airflow and allow for maximum cooling efficiency.
In addition to the fins, there is also a base plate that sits at the bottom of the heat sink and helps to create even more effective cooling. This base plate is made from aluminum and helps to keep the airflow in the heat sink as uniform as possible. This helps to keep the temperature of the components inside the heat sink consistent and prevents overheating.
The working principle of a heat sink like this is quite simple. Heat is drawn away from the components inside the heat sink and dissipated through the fins to the surrounding air. The heat is then carried away by the air, allowing the components to stay cool and maintain their optimal operating temperatures.
As this heat sink is designed for high power electronics, it is important to make sure that the air flow is as uniform as possible. The fins can be adjusted to ensure this, and the base plate will help to evenly spread air across the top of the heat sink. This allows for maximum cooling efficiency and helps to keep the components inside the heat sink operating at their best.
The ATS-13E-184-C2-R0 heat sink is a great option for electronics engineers looking to cool their components and systems. It offers effective cooling and is designed for use in microprocessor applications and other high power electronics. With its large dissipation area and efficient aluminum construction, this heat sink offers maximum cooling efficiency and helps to keep your components running at their best.
The specific data is subject to PDF, and the above content is for reference