| Allicdata Part #: | ATS-13E-198-C3-R0-ND |
| Manufacturer Part#: |
ATS-13E-198-C3-R0 |
| Price: | $ 3.58 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X12MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13E-198-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.25710 |
| 30 +: | $ 3.16932 |
| 50 +: | $ 2.99326 |
| 100 +: | $ 2.81717 |
| 250 +: | $ 2.64109 |
| 500 +: | $ 2.55305 |
| 1000 +: | $ 2.28894 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks have become widely used in the electronics industry due to their ability to provide efficient cooling solutions for various applications. The ATS-13E-198-C3-R0 Heat Sink is one of the best-known examples of this.The ATS-13E-198-C3-R0 Heat Sink is a compact, low-profile heat sink that is designed for cooling applications with limited space. The heat sink features a finned design and is constructed from anodized aluminum that is then thermally bonded to the substrate. It is designed for efficient thermal transfer between the thermal pad and the substrate, and its finned design increases the total surface area which increases performance.The ATS-13E-198-C3-R0 Heat Sink is suitable for use in a variety of applications and can be used to cool electronics, automotive components, medical devices, and more. The heat sink has high reliability and can operate in temperatures up to 200°C. It is designed to dissipate up to 120W of power and has a low thermal resistance of 0.06°C/W. The heat sink is also relatively lightweight, making it easy to handle and install in tight spaces.When it comes to the ATS-13E-198-C3-R0 Heat Sink’s working principle, it works by transferring heat from the thermal pad on the substrate to the fins of the heat sink. The finned design increases the thermodynamic heat transfer area and uses convection to disperse the heat away from the source. In addition, the heat sink features an anodized aluminum construction which helps to increase its thermal performance.The ATS-13E-198-C3-R0 Heat Sink is an ideal solution for applications that require a low-profile, compact cooling solution. Its anodized aluminum design and finned construction help to maximize heat transfer and make it an ideal solution for cooling components in a variety of applications. With a high-performance design, low thermal resistance, and maximum power dissipation, the ATS-13E-198-C3-R0 Heat Sink is the perfect choice for any application that requires a reliable and efficient heat sink.
The specific data is subject to PDF, and the above content is for reference