ATS-13E-22-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-13E-22-C1-R0-ND

Manufacturer Part#:

ATS-13E-22-C1-R0

Price: $ 4.24
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X12.7MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-13E-22-C1-R0 datasheetATS-13E-22-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.81717
30 +: $ 3.60507
50 +: $ 3.39293
100 +: $ 3.18087
250 +: $ 2.96881
500 +: $ 2.75675
1000 +: $ 2.70374
Stock 1000Can Ship Immediately
$ 4.24
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 13.82°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-13E-22-C1-R0 is a thermal-heat sink technology treatment system designed to help in providing a highly efficient heat sink solution. The technology has been developed with the intention of providing an efficient and reliable way to dissipate heat from electronic components. The ATS-13E-22-C1-R0 can be used in a variety of applications and is designed to provide an effective solution to heat dissipated from electronic components, such as processors, memories, power supplies, and more.

The ATS-13E-22-C1-R0 system is composed of a thermal-heat sink and a heat pipe. The thermal-heat sink is a metal structure with a large number of fins arranged on its surface. The fins act as a heat exchanger, dissipating the heat from the components within the system. The heat pipe is a tube filled with a specialized coolant, like water or ethylene glycol. This coolant is designed to carry heat away from the heat sink, allowing it to cool down quickly and efficiently.

The main benefit of using a thermal-heat sink is that it offers better cooling efficiency than traditional air-cooling systems. This type of system is much more efficient, providing superior cooling performance and longer lifespans for electronic components. Thermal-heat sinks also minimize the risk of overheating, which can lead to premature component failure.

When using the ATS-13E-22-C1-R0, the system is designed to be mounted directly onto a surface. This allows the thermal-heat sink to be placed near the components, ensuring that the heat is dissipated in the most effective manner. The ATS-13E-22-C1-R0 also features a patented thermal-heat control system, which helps to ensure that the cooling performance of the system is maintained at the highest possible level.

The ATS-13E-22-C1-R0 is designed to be used in a variety of applications, including CPU and memory cooling, as well as powering up and running demanding applications. It can also be used for powering applications such as game consoles, VR goggles, HD video, and more. The system is also ideal for data centers, servers, and other high-end computing applications.

The ATS-13E-22-C1-R0 is easy to install and is designed to be installed in a matter of minutes. The system does not require any kind of tools or specialized knowledge, and the installation process is simple and straightforward. Once installed, the ATS-13E-22-C1-R0 will provide high-efficiency cooling for many years to come.

The ATS-13E-22-C1-R0 is a highly efficient thermal-heat sink solution for a variety of applications. It is designed to provide reliable cooling solutions for electronic components, and its patented thermal-heat control system ensures that the system operates at optimum efficiency. The system is easy to install and provides years of reliable cooling performance.

The specific data is subject to PDF, and the above content is for reference

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