| Allicdata Part #: | ATS-13E-27-C1-R0-ND |
| Manufacturer Part#: |
ATS-13E-27-C1-R0 |
| Price: | $ 5.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13E-27-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.39028 |
| 30 +: | $ 5.09061 |
| 50 +: | $ 4.79128 |
| 100 +: | $ 4.49177 |
| 250 +: | $ 4.19232 |
| 500 +: | $ 3.89287 |
| 1000 +: | $ 3.81801 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.23°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are critical components of most electronics to help dissipate heat and improve the performance of the equipment. The ATS-13E-27-C1-R0 is a special type of thermal heat sink designed for improved efficiency and reliability.
The ATS-13E-27-C1-R0 is made of aluminum and designed with fins for maximum heat dissipation. The design itself aids in heat reduction by utilizing a combination of air intake, conduction, and convection. The fins trap and carry away the hot air produced within the equipment, allowing cool air to be drawn in from outside the equipment and circulated throughout the system. This helps keep the temperature inside the equipment at an optimum level.
In addition to the design, the ATS-13E-27-C1-R0 offers superior connector reliability. The connectors are designed to fit most standard connectors, increasing the connection life of the components and providing improved resistance to environmental factors. Additionally, the design of the connectors reduces the amount of vibration and shock, making them less likely to become damaged from those sources.
The ATS-13E-27-C1-R0 is primarily used to dissipate heat from electronic components, such as integrated circuits, transistors, DSPs, and others. By dissipating the heat generated from these components, the ATS-13E-27-C1-R0 helps to reduce the temperature of the equipment and thus improve its efficiency and reliability. This allows for greater performance and a better overall user experience.
The ATS-13E-27-C1-R0 is also easy to install and can be used on a variety of substrates, such as ICs, PCBs, and other materials. It also allows for improved thermal conductivity, allowing the heat generated by electronic components to be evenly spread across the entire surface of the substrate rather than concentrated in the center of the substrate.
Overall, the ATS-13E-27-C1-R0 is an excellent choice for thermal management of electronic components. Its combination of effective design, superior connector reliability, and easy installation make it an ideal choice for a variety of applications. By utilizing this thermal heat sink, manufacturers are able to ensure that their products are well-protected and performing at peak levels.
The specific data is subject to PDF, and the above content is for reference