| Allicdata Part #: | ATS-13E-28-C1-R0-ND |
| Manufacturer Part#: |
ATS-13E-28-C1-R0 |
| Price: | $ 6.22 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X15MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13E-28-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.59818 |
| 30 +: | $ 5.28738 |
| 50 +: | $ 4.97624 |
| 100 +: | $ 4.66528 |
| 250 +: | $ 4.35426 |
| 500 +: | $ 4.04324 |
| 1000 +: | $ 3.96549 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.57°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are a crucial component in electronics and computer engineering, allowing them to maintain their temperature with efficiency and accuracy. The ATS-13E-28-C1-R0 is an industry-standard heat sink and is widely used for a variety of applications. This article details the application field and working principle of the ATS-13E-28-C1-R0.
The ATS-13E-28-C1-R0 heat sink is a particularly popular choice for central processing unit (CPU) and graphics processor applications. These components are often vulnerable to heat buildup, which can lead to poor overall performance or even complete failure. The ATS-13E-28-C1-R0 is designed with fins that create a larger surface area, allowing for increased air flow and thus more effective heat dissipation. The fins also feature PECVD coating, which is resistant to high temperatures.
In addition to CPUs and GPUs, the ATS-13E-28-C1-R0 is also used in specialized applications such as semiconductors, transistors, and switches. These components generate a great deal of heat and can easily become damaged if not kept within their temperatures. The heat sink efficiently dissipates the heat, while at the same time having minimal weight. This makes it the perfect choice for applications where space and weight are important considerations.
The working principle of the ATS-13E-28-C1-R0 is relatively simple. Heat is absorbed into the heat sink and then transferred to the fins. The fins act as radiators, dispersing the heat into the surrounding air. As the temperature of the fins is lower than the temperature of the component, the heat is quickly dissipated with minimal energy consumption. Through this process, the component\'s temperature is kept in check.
The ATS-13E-28-C1-R0 is an efficient and reliable heat sink solution for a wide range of applications. It allows for efficient heat dissipation with minimal energy consumption, while at the same time being lightweight and robust. Its use in a variety of components makes it a popular choice for many engineers and technicians working in the electronics and computer engineering fields.
The specific data is subject to PDF, and the above content is for reference