| Allicdata Part #: | ATS-13E-35-C1-R0-ND |
| Manufacturer Part#: |
ATS-13E-35-C1-R0 |
| Price: | $ 5.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X5.84MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13E-35-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.60341 |
| 30 +: | $ 4.34784 |
| 50 +: | $ 4.09210 |
| 100 +: | $ 3.83632 |
| 250 +: | $ 3.58057 |
| 500 +: | $ 3.32481 |
| 1000 +: | $ 3.26087 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.230" (5.84mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 22.46°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become increasingly important to manufacturers in recent years. This is especially true of electronics manufacturers that depend on the thermal stability of components and products. Thermal management is a complex subject and is often perceived as a form of art. Today, there are certain products on the market such as the ATS-13E-35-C1-R0 that are purpose-built to help ensure optimal thermal performance in devices.
What is the ATS-13E-35-C1-R0?
The ATS-13E-35-C1-R0 is a type of thermal heat sink manufactured by Aavid. It is designed to improve the thermal performance of electronic components by dissipating excess heat. This helps to protect the components from potential damage resulting from overheating. The ATS-13E-35-C1-R0 offers superior heat dissipation, making it ideal for use in high-performance applications.
Application Field
Due to the superior thermal management of the ATS-13E-35-C1-R0, it is commonly used in a variety of applications where heat dissipation is critical. Such applications include power amplifiers, telecommunications equipment, personal computer components, automotive electronics, solar energy systems, and servers.
In the industrial sector, the ATS-13E-35-C1-R0 can be used in a variety of applications where thermal management is critical for success. This includes industrial process controls, medical devices, electric motors and generators, and robotics. In short, the ATS-13E-35-C1-R0 is suitable for any application where improving thermal performance is of top priority.
Working Principle
The ATS-13E-35-C1-R0 is designed with an aluminum base and a finned heat sink. A finned heat sink is a type of heat sink that uses protruding fins to dissipate heat more efficiently by providing a larger surface area. This, combined with the heat-absorbing properties of the aluminum base, helps to ensure that the heat is quickly dissipated from the component. The heat sink also includes several U-clips to secure it to a device.
Conclusion
The ATS-13E-35-C1-R0 is designed for superior thermal management. It is commonly used in a variety of applications where thermal stability is essential, such as power amplifiers, telecommunications equipment, industrial process controls, and medical devices. The superior finned heat sink design and aluminum base of the ATS-13E-35-C1-R0 help to ensure maximum heat dissipation, allowing for improved performance in demanding applications.
The specific data is subject to PDF, and the above content is for reference