| Allicdata Part #: | ATS-13E-49-C3-R0-ND |
| Manufacturer Part#: |
ATS-13E-49-C3-R0 |
| Price: | $ 3.48 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13E-49-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.16197 |
| 30 +: | $ 3.07671 |
| 50 +: | $ 2.90581 |
| 100 +: | $ 2.73489 |
| 250 +: | $ 2.56397 |
| 500 +: | $ 2.47851 |
| 1000 +: | $ 2.22211 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 26.55°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a key factor in the performance of electronic components and equipment. Without proper thermal control, it is possible to suffer from expensive equipment damage, instability, performance degradation, and catastrophic failure. The ATS-13E-49-C3-R0 is a heat sink designed to help manage the thermal properties of electronic components and equipment.
A heat sink is an electronic component that is designed to transfer heat away from an electronic component and dissipate it into the ambient environment. Heat sinks are generally created of metal base materials which are optimized for specific thermal values and performance criteria. In the case of the ATS-13E – 49-C3-R0, the base material is aluminum. Aluminum is very adept at transferring and dissipating heat away from the components to which it is attached.
The ATS-13E-49-C3-R0 can be mounted to a host component via a mounting clip, screws, or welding depending on the install requirements. The heat sink itself is composed of several features to aid in its ability to transfer and dissipate thermal energy. The primary features are the fins, baseplate, and support structure, as well as optional extras such as convection enhancers.
The fins of the heat sink are what draw the heat away from the component. The fins contain several strategically placed channels and crevices to direct the incoming air as it passes over them. This helps promote maximum air flow both around the fins and through the fins, allowing the maximum amount of heat to be absorbed and dissipated. The base plate is the solid base of the heat sink and provides the support to the fins. The support structure varies depending on the design and holds all of the components together.
The ATS-13E-49-C3-R0 is designed and optimized for use in a variety of thermal management applications. On one hand, it can be used to cool electronic components such as CPUs, GPUs, and FPGAs. On the other hand, it can be used to cool larger assemblies such as rack mounted power electronics or server equipment. Due to the design of the heat sink and the ability to add convection enhancers, it is also ideal for use in high temperature or higher power consumer applications.
The ATS-13E-49-C3-R0 is an effective and reliable heat sink for a variety of thermal management applications. Its aluminum base material is highly effective at dissipating heat away from components attached it to. The design of the heat sink promotes maximum airflow allowing for greater heat absorption and dissipation. With its flexible mounting options and optional add ons, this makes the ATS-13E-49-C3-R0 a versatile and effective thermal management solution.
The specific data is subject to PDF, and the above content is for reference