ATS-13E-64-C2-R0

The ATS-13E-64-C2-R0 is a thermal heat sink designed to help keep you cool. This advanced heat sink uses an efficient cooling system to dissipate heat away from electronic components, and is specifically designed to reduce the temperature of a processor or IC chip. The ATS-13E-64-C2-R0 employs a patented design that utilizes an optimized fin structure, enabling it to take up minimal space and provide effective cooling while maintaining low noise levels. It also features a unique, flexible aluminum base that compensates for uneven surfaces.

The ATS-13E-64-C2-R0 has a wide range of applications, and can be used for a variety of tasks, including cooling a motherboard, heat sink upgrades, over-clocking, and hard-disk cooling. It\'s also well-suited for data centers, servers, medical equipment, industrial control systems, and other applications where thermal management is critical.

The ATS-13E-64-C2-R0 works by transferring heat from its source to the heatsink via conduction. Heat is transferred from the source (a processor, IC chip, or other heat-producing component) to the fins of the heat sink via direct contact, and then dissipated via convection. The fins of the heat sink aid in dissipating the heat faster and more efficiently than just the source alone, and the fan helps in further lessening the temperature. The fan can be adjusted to various speeds, allowing for more precise cooling.

The ATS-13E-64-C2-R0 is a highly efficient thermal heat sink, designed to be a dependable and reliable cooling solution. Its patented design is tailored for maximum cooling efficiency, and its flexible aluminum base provides superior contact between the heatsink and source, allowing for efficient heat transfer at temperatures up to 100°C. The ATS-13E-64-C2-R0 is also easy to install and maintain, and can be used for a variety of applications, making it a great choice when it comes to thermal management.