| Allicdata Part #: | ATS-13E-93-C1-R0-ND |
| Manufacturer Part#: |
ATS-13E-93-C1-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13E-93-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.37617 |
| 30 +: | $ 3.28503 |
| 50 +: | $ 3.10250 |
| 100 +: | $ 2.91999 |
| 250 +: | $ 2.73748 |
| 500 +: | $ 2.64622 |
| 1000 +: | $ 2.37248 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal and heat sinks are essential components for dissipating heat efficiently from electronic or other components. ATS-13E-93-C1-R0 is a heat sink that belongs to the ATS family of heat sinks, with a variety of heat dissipating capabilities and functions, designed to handle specific needs in a variety of applications.
This particular heat sink has the capability to dissipate heat from a variety of sources. It is designed to handle high temperatures efficiently and effectively, and is perfect for high power applications. It is lightweight, durable, and constructed from heat-dissipating aluminum. The design of the ATS-13E-93-C1-R0 also makes it perfect for those challenging environments which require higher temperatures.
The ATS-13E-93-C1-R0 is designed to handle a variety of temperatures and applications. This heat sink can be used in a variety of industrial applications, such as telecommunications, automotive, medical, and military/defense. Some of the key features of this heat sink include: an integrated frame and cover, an adjustable two-stage fan system, and an adjustable airflow system. Additionally, the heat sink has a rugged, corrosion-resistant coating, making it ideal for tough industrial and military/defense applications.
The ATS-13E-93-C1-R0 is designed to dissipate heat from various electronic components. It is designed to dissipate heat quickly, and is ideal for applications that require quick cooling. The heat sink is designed to dissipate up to 100% of the maximum power. The maximum power rating is based on the type of component being used. Additionally, this thermal and heat sink has adjustable airflow to ensure that the temperature is kept within a comfortable range.
In addition to dissipating heat, the ATS-13E-93-C1-R0 also offers thermal stability. This thermal stability helps to ensure that the components being used operate at a consistent temperature, helping to minimize any temperature variations. The thermal stability also helps to reduce any corrosion or degradation of the components within the application.
The ATS-13E-93-C1-R0 also offers some other features and benefits. It is designed to be compatible with a variety of power connectors, allowing for easy installation and removal. Additionally, this heat sink is designed with an adjustable two-stage fan system, allowing it to be easily adjusted to meet the needs of different applications. Finally, this thermal and heat sink is designed to allow for an effective airflow, which helps to dissipate heat more efficiently.
Overall, the ATS-13E-93-C1-R0 thermal and heat sink is designed to handle applications with high power requirements. It is lightweight, durable, and designed to dissipate heat from various components efficiently and quickly. Additionally, it is designed to provide thermal stability and to reduce any corrosion or degradation of components within the application. With its adjustable two-stage fan system and adjustable airflow, it allows for effective cooling. This thermal and heat sink is perfect for a variety of applications, including telecommunications, automotive, medical, and defense.
The specific data is subject to PDF, and the above content is for reference