| Allicdata Part #: | ATS-13F-10-C1-R0-ND |
| Manufacturer Part#: |
ATS-13F-10-C1-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13F-10-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28104 |
| 30 +: | $ 3.19242 |
| 50 +: | $ 3.01505 |
| 100 +: | $ 2.83771 |
| 250 +: | $ 2.66036 |
| 500 +: | $ 2.57169 |
| 1000 +: | $ 2.30565 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks for electronics are essential components in many industries, from automotive to medical electronics. The ATS-13F-10-C1-R0 is a heat sink designed to meet the rigors of high-powered electronics applications. It is particularly well-suited for devices such as microcontrollers and power transistors, which often require fast, efficient heat dissipation. Here, we\'ll explore the application field of the ATS-13F-10-C1-R0 and its working principle.
Application Field: The ATS-13F-10-C1-R0 heat sink has been designed with maximum versatility in mind. It is suitable for a wide range of electronic components, including microcontrollers and power transistors. With its efficient cooling performance, it\'s particularly well-suited for high-powered applications, such as those found in automotive and medical electronics. The ATS-13F-10-C1-R0 is also suitable for efficient thermal management in space-limited systems, such as embedded systems.
Working Principle: The ATS-13F-10-C1-R0\'s cooling efficacy is based on the principles of conduction and convection. Heat generated by the components is conducted through the heat sink\'s aluminum fins to the surface of the sink, where it is dissipated to the ambient air by convection. The sink\'s aluminum fins are designed to create maximum contact area between the heat sink and the component, allowing for efficient heat transfer. Other features, such as the C-shaped fins and the heat-dissipating pin design, further enhance the cooling performance.
The ATS-13F-10-C1-R0 has been designed to work in harsh environments. The aluminum fins are 0.085mm in thickness, making them resistant to vibration and impact. The fin design has also been specially tuned to increase air flow and acceleration, making it more efficient in dissipating heat. The heat sink is also designed with a rounded edge to reduce noise caused by airflow turbulence.
The ATS-13F-10-C1-R0 is a reliable and cost-efficient choice for any high-powered electronics application. With its efficient cooling performance and durable construction, it is perfect for devices such as microcontrollers and power transistors that require fast and efficient thermal management. Its versatility also makes it ideal for applications such as embedded systems where space is at a premium.
The specific data is subject to PDF, and the above content is for reference