ATS-13F-10-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS22648-ND

Manufacturer Part#:

ATS-13F-10-C2-R0

Price: $ 4.19
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-13F-10-C2-R0 datasheetATS-13F-10-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.80520
10 +: $ 3.70125
25 +: $ 3.49574
50 +: $ 3.29011
100 +: $ 3.08448
250 +: $ 2.87885
500 +: $ 2.67322
1000 +: $ 2.62181
Stock 1000Can Ship Immediately
$ 4.19
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.89°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are necessary components in many electrical and electronics applications, particularly in applications that require cooling, such as power supply systems or computers. The ATS-13F-10-C2-R0 is a high-performance thermal heat sink designed for efficient cooling of electronic components. It features a fin array design that maximizes thermal performance by increasing surface area for convection cooling. The fin array is designed for high thermal dissipation, which makes it particularly suitable for use in applications where efficiency is critical.

The ATS-13F-10-C2-R0 has optimized thick fins and grooves for improved thermal contact. This increases the thermal performance of the system, allowing for faster heat transfer from the heat source to the outside air.

The ATS-13F-10-C2-R0 has excellent reliability and high tolerance to environment a combination of a few features such as a fan, high-density fins, shallow fins and a refined fin structure. These features improve the unit\'s thermal performance while maintaining a low cost. The unit also features a plastic base which is designed to provide additional support and stability.

The ATS-13F-10-C2-R0 has two main components, the fan and the fin array. The fan is designed to provide the airflow that is directed to the fin array. This design helps to ensure that the heat is transferred from the heat source to the outside environment. The fin array is designed for optimal heat dissipation. The high-density fin design increases surface area for convection cooling and the grooves and shallow fins allow for better thermal contact.

The working principle of the ATS-13F-10-C2-R0 is relatively simple. The fan pulls in air from the outside and directs it towards the fin array. This airflow creates convection cooling, which transfer heat away from the heat source. The air passes through the fin array, where the heat is dissipated into the outside environment.

The ATS-13F-10-C2-R0 is ideally suited for a variety of applications, particularly those that require efficient cooling. Its optimal design allows for much faster heat transfer compared to other thermal solutions. The unit is very reliable and offers superior performance and reliability compared to other models in its class. The unit also offers excellent value for money, as it is extremely cost effective.

The ATS-13F-10-C2-R0 is a great thermal solution for a variety of applications and is ideal for heavy-duty and high-performance applications. Its high-density fin design offers superior performance when compared to other solution and its plastic base provides additional stability and support. The unit is very reliable and offers excellent value for money, making it a great choice for a variety of applications.

The specific data is subject to PDF, and the above content is for reference

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