ATS-13F-101-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS22650-ND

Manufacturer Part#:

ATS-13F-101-C2-R0

Price: $ 5.28
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X30MM R-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-13F-101-C2-R0 datasheetATS-13F-101-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 4.80060
10 +: $ 4.67271
25 +: $ 4.41328
50 +: $ 4.15372
100 +: $ 3.89416
250 +: $ 3.63455
500 +: $ 3.37494
1000 +: $ 3.31003
Stock 1000Can Ship Immediately
$ 5.28
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.181" (30.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 6.69°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal management for electronic systems can be extremely important when it comes to ensuring proper operations within the system. In general, these systems must be in a temperature range within acceptable levels to ensure proper and reliable operations. Heat sinks are one part of the puzzle and are employed to help reduce the temperature of the electronic system. The ATS-13F-101-C2-R0 is one such heat sink and can be used to manage the thermal operations of a variety of different electronic systems. This article will discuss the application field and working principle of the ATS-13F-101-C2-R0 heat sink.

The ATS-13F-101-C2-R0 is a type of heat sink, also known as a “cold plate”. This specific type of cold plate is designed to be used in industrial systems, telecommunications systems, and a variety of other electronic systems. It is constructed with aluminum, sliced into small and precise shapes, with deep grooves to aid in dissipating heat. This specific cold plate is designed to provide an efficient and reliable way to dissipate heat from components beneath the plate, and into the system’s environment. As a result, this simple yet effective design helps protect components from overheating and malfunctioning.

The working principle of the ATS-13F-101-C2-R0 is fairly simple. The plate itself is designed to be mounted onto the electronic system, typically onto a component with a higher temperature. This creates a direct contact with the component, allowing for heat to be drawn away from the component and through the grooves of the plate. The plate also creates an interface between it and the air, which in turn helps the thermal energy to be evenly dispersed away from the system. As the plate heats up, it begins to dissipate the thermal energy into the surrounding air, which helps to keep the system within an acceptable temperature range.

The ATS-13F-101-C2-R0 is also designed with a few other features as well. It is designed to be sturdy and lightweight, making it easy to mount onto electronic systems. It also has an anodized finish on the aluminum slices, which helps to reduce the risk of corrosion and damage from the environment. The design also allows for easy installation onto any system, providing a reliable and efficient means for protecting components from excessive thermal energy.

In conclusion, the ATS-13F-101-C2-R0 heat sink is a reliable and efficient solution for managing thermal operations within a wide range of electronic systems. Its simple design and robust construction make it the perfect choice for managing a variety of thermal operations and providing reliable and efficient protection to components. The application field of the ATS-13F-101-C2-R0 is vast and can span multiple industries, from industrial to telecommunications systems. Furthermore, its working principle is simple and effective, making it a great choice for managing the thermal energy of the electronic system.

The specific data is subject to PDF, and the above content is for reference

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