| Allicdata Part #: | ATS-13F-108-C3-R1-ND |
| Manufacturer Part#: |
ATS-13F-108-C3-R1 |
| Price: | $ 4.98 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X40X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13F-108-C3-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.48812 |
| 30 +: | $ 4.23864 |
| 50 +: | $ 3.98929 |
| 100 +: | $ 3.73993 |
| 250 +: | $ 3.49061 |
| 500 +: | $ 3.24127 |
| 1000 +: | $ 3.17894 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.12°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has been a key challenge in many applications. Heat sinks are one of the most common solutions to dissipate the generated heat, therefore, ensuring the proper function and longevity of the device. Heat sinks are used in many applications such as medical, communications, avionics, automotive, consumer electronics, and more. The ATS-13F-108-C3-R1 has been designed to effectively manage thermal challenges. In this article, we will discuss the application field and working principle of the ATS-13F-108-C3-R1 heat sink.
The ATS-13F-108-C3-R1 heat sink is a high-performance, closed-loop cooling module. It is designed to dissipate a wide range of temperatures and can be used in a variety of applications, including industrial, computer, and consumer electronics. The heat sink has an anodized aluminum frame and a sealed enclosure for maximum protection against dust and debris. The aluminum frame has four slots on each side designed to accept screws, bolts, or rivets for mounting into a device.
The ATS-13F-108-C3-R1 uses a combination of high-efficiency thermally conductive material, an anodized aluminum frame, and a sealed enclosure to dissipate heat effectively. The aluminum frame and sealed enclosure provide a highly efficient heat-dissipation area, resulting in greater heat transfer efficiency than traditional aluminum heat sinks. Additionally, the anodized aluminum frame offers superior corrosion resistance and structural integrity.
The ATS-13F-108-C3-R1\'s working principle is based on the Bernoulli effect, which states that when a fluid is moved, it generates a pressure differential across its surface. This pressure differential causes air to move through the fins, thereby dissipating the heat from the fins. The air flow is controlled by controlling the velocity of the airflow, which is achieved by adjusting the fan speed. The fan speed can be adjusted manually or automatically, depending on the ambient temperature and the requirements of the system.
The ATS-13F-108-C3-R1 heat sink is highly versatile and can be used in a variety of applications. The thermal performance of the ATS-13F-108-C3-R1 is also suitable for medical and military applications where extreme temperatures are present. Additionally, its low-noise operation makes it ideal for use in audio or video equipment.
Overall, the ATS-13F-108-C3-R1 heat sink is designed to provide efficient thermal management in a variety of applications. The combination of its highly efficient thermally conductive material, anodized aluminum frame, and sealed enclosure make it an ideal solution for dissipating heat generated by various electronic components. Its adjustable fan speed ensures the optimal performance of the system, while its noise-free operation offers an added level of convenience.
The specific data is subject to PDF, and the above content is for reference