| Allicdata Part #: | ATS-13F-110-C1-R1-ND |
| Manufacturer Part#: |
ATS-13F-110-C1-R1 |
| Price: | $ 4.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X40X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13F-110-C1-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.14099 |
| 30 +: | $ 3.91083 |
| 50 +: | $ 3.68084 |
| 100 +: | $ 3.45076 |
| 250 +: | $ 3.22071 |
| 500 +: | $ 2.99066 |
| 1000 +: | $ 2.93315 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 26.97°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are a crucial tool in the management and regulation of temperatures, especially in electronic components. The ATS-13F-110-C1-R1 heat sink is a potent tool for optimal temperature control, making it a popular choice for many electronic applications.
The ATS-13F-110-C1-R1 heat sink is designed to be used in high power systems. It is constructed from aluminum, which is highly conductive and dissipates heat quickly. The heat sink is designed to absorb and spread heat away from the device under test as quickly as possible, allowing for optimal temperature regulation. It is also available in a wide range of sizes and configurations to meet the needs of various systems and heat loads.
The ATS-13F-110-C1-R1 is designed for applications where heating and cooling cycles may occur over a short period of time. It has been designed with a dual-fan configuration, which keeps the system cool and reduces power consumption. It also provides protection for the component under test by helping to prevent it from overheating. This heat sink has also been designed with an electroplated finish, which provides additional protection against dust and debris, ensuring that the component under test remains clean and operational.
The ATS-13F-110-C1-R1 can be used in a wide range of applications, such as data communications, audio/video equipment, mobile devices, and medical equipment. It offers superior thermal performance and is capable of quickly dissipating heat from the component under test. This heat sink is also ideal for use in applications that require rapid temperature changes, such as in high-speed processors or other high-power devices.
In addition to its primary duties, the ATS-13F-110-C1-R1 also offers other features such as an easy-to-install design and a reliable locking mechanism. This ensures that the component remains in its optimal operating position, allowing for the most efficient and effective operation. It also offers excellent protection against vibration and electrical noise, ensuring a stable and reliable performance.
The ATS-13F-110-C1-R1 is an ideal choice for applications that require a reliable and efficient heat sink. It provides excellent thermal performance, a long life span, and is relatively easy to install and use. With its dual fan design and electroplated finish, this heat sink is sure to provide the results you need with the temperature control and protection your system requires.
The specific data is subject to PDF, and the above content is for reference