ATS-13F-110-C3-R1

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	2.126" (54.01mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.500" (12.70mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	27.08°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to ATS-13F-110-C3-R1 Thermal - Heat SinkThe ATS-13F-110-C3-R1 thermal - heat sink is a type of heat-dissipating radiator commonly used in various applications. Heat sinks are usually made of metal sheets with several fins that serve to spread the heat over a large surface area. In this way, they help to reduce the risk of overheating, a common problem in electrical systems. The ATS-13F-110-C3-R1 heat sink is particularly suitable for use in high-voltage electronic equipment.Application Field of ATS-13F-110-C3-R1 Thermal - Heat SinkATS-13F-110-C3-R1 heat sinks are widely used in electronic devices, home appliances, communication devices, LED lighting, industrial power supply, electronic equipment and other electronic fields.This type of heat sink is also suitable for use in voltages up to 1000V. Its high conductivity ensures effective heat dissipation and thus better protection of sensitive components.Working Principle of ATS-13F-110-C3-R1 Thermal - Heat SinkAs mentioned above, the ATS-13F-110-C3-R1 thermal - heat sink consists of metal sheets with several fins. These fins act as a radiator, ensuring effective heat dissipation. The large surface area of the fins ensures that heat dissipates quickly and evenly.The fins are connected to a mounting plate. This plate also acts as a heatsink by providing an additional conductive pathway for the heat. It can be made of aluminum, copper or other metals.The ATS-13F-110-C3-R1 thermal - heat sink is designed to dissipate heat away from sensitive electronic components without causing them to overheat or malfunction. This is done by providing a large surface area to spread the heat over, as well as by providing an additional conductive pathway through the mounting plate.ConclusionIn conclusion, the ATS-13F-110-C3-R1 thermal - heat sink is a type of metal-sheet heat dissipation radiator. It is widely used in electronic fields to dissipate heat away from sensitive components without causing them to overheat or malfunction. Its high conductivity ensures effective heat dissipation and better protection of sensitive components. By providing a large surface area and an additional conductive pathway, it ensures that heat dissipates quickly and evenly.

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