ATS-13F-12-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS22670-ND

Manufacturer Part#:

ATS-13F-12-C2-R0

Price: $ 4.16
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X12.7MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-13F-12-C2-R0 datasheetATS-13F-12-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.78000
10 +: $ 3.67794
25 +: $ 3.47382
50 +: $ 3.26957
100 +: $ 3.06520
250 +: $ 2.86086
500 +: $ 2.65651
1000 +: $ 2.60542
Stock 1000Can Ship Immediately
$ 4.16
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.500" (12.70mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 15.86°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-13F-12-C2-R0 is one of the several thermal-heat sinks on the market today. It is designed to help maintain a comfortable temperature within a system, which is particularly useful in projects that demand high performance. As its name implies, this device works by transferring heat away from the system, while still allowing for an effective cooling solution.

In terms of features, the ATS-13F-12-C2-R0 includes a heat sink construction made of aluminum plate that provides efficient heat dissipation, an electroless nickel plating to protect against corrosion, and a soldered pin system to keep electrical connections secure. This makes it well suited for working within tight spaces where maintaining a controlled temperature is important. Additionally, its universal mounting holes allow the heat sink to be easily installed in different face plate configurations.

When using the ATS-13F-12-C2-R0, the heat generated by the components are passed into the heat sink and spread out over a large surface area. As the heat is dissipated, cold air from the environment is drawn in from the same area. This leads to multiple airflows within the system, working together to lower the temperature.

This type of thermal-heat sink operates through an advanced principle known as “interactive cooling.” Here, the coefficient of thermal conductivity is increased without increasing the heat load on the components. This results in improved heat dissipation and more reliable performance over time. Furthermore, this technology is also found in other cooling devices such as compressors.

Aside from providing efficient cooling, the ATS-13F-12-C2-R0 also comes with a few additional benefits. For instance, its heat exchanger technology allows for a better thermal performance, while its robust construction makes it less prone to damage. Additionally, it is designed to be vibration-resistant, making it highly suitable for applications that require robust operation in harsh environments. Its low weight is an added advantage, as it makes installation and maintenance much easier.

In conclusion, the ATS-13F-12-C2-R0 is a great thermal-heat sink for those who require efficient cooling within tight spaces. With its versatile mounting holes, robust construction, vibration resistance, and lightweight design, it makes maintaining a comfortable temperature level within the system much easier. Moreover, its interactive cooling technology is highly reliable, making this unit a great long-term investment.

The specific data is subject to PDF, and the above content is for reference

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