
Allicdata Part #: | ATS-13F-128-C3-R0-ND |
Manufacturer Part#: |
ATS-13F-128-C3-R0 |
Price: | $ 4.33 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 54X54X25MM XCUT T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.89781 |
30 +: | $ 3.68151 |
50 +: | $ 3.46487 |
100 +: | $ 3.24834 |
250 +: | $ 3.03178 |
500 +: | $ 2.81523 |
1000 +: | $ 2.76109 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 2.126" (54.01mm) |
Width: | 1.575" (40.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 2.98°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
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The ATS-13F-128-C3-R0 is a heat sink in the thermal, heat sink category. It is made up of aluminum alloy die-casting, stainless steel screw and also a fan. This thermal, heat sink device is designed to operate in an ambient temperature of -40 to 105°C.
The application field of this thermal, heat sink device includes many industries like electronic circuit, resolution control system, precision medical equipment, UPS power supply, and computer server. The fan can dissipate the thermal, heat generated from these systems and components to maintain an optimal working temperature for them.
The working principle for the ATS-13F-128-C3-R0 thermal, heat sink device is based on the heat dissipation functionality of the fan. The fan is designed to have high air flow rating of 80CFM and a noise level of 26dB. When the fan is used along with some thermal passive materials such as copper and aluminum, it helps to cool the internal components. The aluminum alloy die casting provides a good thermal dissipation through its good thermal conductivity, and its stainless steel screws help to secure the components in place.
The thermal, heat sink device is made up of a die-cast aluminum alloy and the fan is designed to dissipate the thermal, heat generated from the components and keep them at an optimal temperature. The stainless steel screws make sure that the components are secure and the fan helps to keep the components cool and running at optimal temperature. The device can be used in a range of applications, including electronics, resolution control systems, precision medical equipment, UPS power supply, and computer server applications.
The ATS-13F-128-C3-R0 thermal, heat sink device is an ideal choice for applications where heat dissipation needs to be controlled and temperature needs to be kept at an optimal level. It is made up of reliable and durable components which provide excellent performance for any application in which a cooling system is required.
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