| Allicdata Part #: | ATS22686-ND |
| Manufacturer Part#: |
ATS-13F-134-C2-R0 |
| Price: | $ 7.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X15MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13F-134-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 6.58350 |
| 10 +: | $ 6.40773 |
| 25 +: | $ 6.05203 |
| 50 +: | $ 5.69596 |
| 100 +: | $ 5.34001 |
| 250 +: | $ 4.98401 |
| 500 +: | $ 4.62801 |
| 1000 +: | $ 4.53900 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions, such as heat sinks, play a key role in electronics applications. Heat sinks are used to dissipate excess heat generated by electronics components, like integrated circuits and resistors. Thermoelectric cooling, or TEC, is a popular type of cooling system used in many modern electronics.ATS-13F-134-C2-R0 is a high-performance TEC cooling heat sink designed and manufactured by ATS Microelectronics. The heat sink is a thermally-enhanced version of a traditional heat sink, and its purpose is to provide extra thermal dissipation for electronic devices and components. Its design makes it suitable for a variety of applications.
ATS-13F-134-C2-R0 Application Field
The ATS-13F-134-C2-R0 heat sink is specially designed for applications that require efficient heat dissipation. It is particularly suitable for applications that need higher thermal stability, such as high frequency semiconductor chips, high power electronics equipment, field programmable gate array (FPGA) acceleration, memory cooling, heat exchange, etc. It is also suitable for LED lighting, high power electronics, and other power conversion applications.
Working Principle
The ATS-13F-134-C2-R0 heat sink works by transferring heat from an electronic device or component to the air surrounding the device or component. This is accomplished by a combination of natural convection, or the flow of air around the device or component, and the use of a finned heat sink that increases the available surface area for heat transfer.The finned heat sink consists of multiple “fins” that are arranged in an array and positioned around the device or component being cooled. These fins allow more heat to be dissipated at any given time, as air can flow around the fins to increase their surface area. The heat is then transferred to the air surrounding the device or component, where it is dissipated.
Advantages of ATS-13F-134-C2-R0
The ATS-13F-134-C2-R0 heat sink has several advantages over other cooling systems. First, it is very powerful and efficient. It can dissipate up to 30 Watts of power from a single device or component. Second, it is lightweight compared to other types of cooling systems. This makes it easier to install and transport. Additionally, it has a very low thermal resistance, meaning that it can transfer large amounts of heat with minimal losses. Finally, it is very cost-effective and can be used in a variety of applications.
Conclusion
The ATS-13F-134-C2-R0 heat sink is an ideal solution for electronics applications that require efficient heat dissipation. It is lightweight, powerful, and has a low thermal resistance, making it an excellent choice for a wide range of applications. With its high performance and cost-effectiveness, the heat sink is an excellent choice for addressing heat-related issues in electronics applications.
The specific data is subject to PDF, and the above content is for reference