| Allicdata Part #: | ATS22687-ND |
| Manufacturer Part#: |
ATS-13F-135-C2-R0 |
| Price: | $ 7.57 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13F-135-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 6.81030 |
| 10 +: | $ 6.43419 |
| 25 +: | $ 6.05581 |
| 50 +: | $ 5.67743 |
| 100 +: | $ 5.29887 |
| 250 +: | $ 4.92040 |
| 500 +: | $ 4.82577 |
| 1000 +: | $ 4.73114 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.00°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction:
The ATS-13F-135-C2-R0 is an thermal heat sink from the ATS line of products. It is designed to provide efficient cooling without a fan or other active cooling components, making it suitable for applications where loud fan noise is unwanted. This heat sink is a reliable solution for dissipating heat from various electronic components, and is often used in audio-visual, telecommunications, and industrial automation applications.
Design:
The ATS-13F-135-C2-R0 heat sink is composed of two body parts: an extruded aluminum base with a 135mm depth and an aluminum fin heatsink, which increases heat transfer performance thanks to its high-density spaced fins. These components are held together by thirteen inserts, enduring the highest thermal loads. Its design gives users the option to mount a fan or other cooling components, providing additional cooling for the system when active cooling is desired.
Heat Transfer:
The main function of the ATS-13F-135-C2-R0 heat sink is to dissipate heat away from electronic components. Heat is conducted from the parts to the heat sink through thermal conduction. This is due to the heat sink’s high thermal conductivity, which allows it to efficiently absorb heat from the components and transfer it away from the parts. The aluminum fins help to further increase the dissipated heat energy, spreading the absorbed heat more evenly and quickly than a flat aluminum plate alone. The combination of these two mechanisms helps to efficiently dissipate heat from the heatsink, providing cooler temperatures for the system.
Mounting:
The ATS-13F-135-C2-R0 heat sink can be mounted to many types of surfaces and components. It is equipped with two M3 metric threads, allowing the part to be mounted to boards and components with M3 screws. Surrounding components can be cooled just as effectively, thanks to the design of the heat sink’s finned body. The fins have a height of 1.5mm, allowing them to fit into tight spaces, providing efficient cooling in these areas.
Conclusion:
The ATS-13F-135-C2-R0 thermal heat sink is a reliable cooling solution for electronic components and systems. Its design allows for high thermal performance, thanks to aluminum body and fin construction, as well as its robust mounting options. Its shallow depth and finned body make it suitable for many different applications and give users the option to mount a fan or other cooling components when more aggressive cooling is required. Overall, the ATS-13F-135-C2-R0 is an effective and reliable thermal heat sink for various electronics and industrial application needs.
The specific data is subject to PDF, and the above content is for reference