| Allicdata Part #: | ATS-13F-14-C3-R0-ND |
| Manufacturer Part#: |
ATS-13F-14-C3-R0 |
| Price: | $ 4.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13F-14-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.74787 |
| 30 +: | $ 3.53934 |
| 50 +: | $ 3.33119 |
| 100 +: | $ 3.12304 |
| 250 +: | $ 2.91483 |
| 500 +: | $ 2.70663 |
| 1000 +: | $ 2.65458 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.05°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are electronic components that are designed to manage thermal energy by dissipating it into the surrounding environment. With advances in semiconductor technology, heat sinks have become increasingly important components in the successful operation of electronic devices. The ATS-13F-14-C3-R0 is a heat sink that finds specific application in the high-performance electronics market.
The ATS-13F-14-C3-R0 heat sink is a combination of an aluminum heatsink base and a top fin with integral fan. This provides for optimal cooling properties in a compact design. The base of the sink includes axial transition fins that enable the efficient transference of heat from the base heatsink to the top fin. The integrated caps on the top of the heatsink have been precision machined to ensure minimum air turbulence, which is essential for effective cooling.
The ATS-13F-14-C3-R0 also includes a highly efficient dc brushless fan. This helps to circulate air through the fin stack, allowing for the most efficient operation of the heat sink. The fan is coupled to the fan holder plate with fasteners to provide a secure connection to the heat sink. The fan is designed to run low noise, with a speed of 3000 rpm and a maximum current draw of 0.36A.
The ATS-13F-14-C3-R0 heat sink also features a unique thermal resistance rating. This rating reflects the thermal performance of the sink when operating at its nominal heat transfer capacity. The thermal resistance is typically rated with somethingcalled a Delta T/W, which is the temperature difference between the sink and ambient, divided by the power dissipation of the device. In the case of the ATS-13F-14-C3-R0, its thermal resistance is rated at 0.55°C/W.
The ATS-13F-14-C3-R0 heat sink can be used in a variety of applications. Its small size makes it ideal for use in high-performance electronic equipment, such as processors, ASICs (application-specific integrated circuit), and other devices that generate excess heat. The heat sink also features a variety of mounting options, allowing for easy installation in a multitude of applications.
The ATS-13F-14-C3-R0 heat sink is an excellent choice for use in high-performance electronic equipment, thanks to its small size, low thermal resistance rating, and efficient cooling properties. Its unique combination of features make it an ideal solution for dissipating the excess heat generated by large-scale electronic devices.
The specific data is subject to PDF, and the above content is for reference