ATS-13F-141-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-13F-141-C1-R0-ND

Manufacturer Part#:

ATS-13F-141-C1-R0

Price: $ 3.27
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X10MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-13F-141-C1-R0 datasheetATS-13F-141-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.97234
30 +: $ 2.89170
50 +: $ 2.73105
100 +: $ 2.57040
250 +: $ 2.40975
500 +: $ 2.32942
1000 +: $ 2.08845
Stock 1000Can Ship Immediately
$ 3.27
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 15.66°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal – Heat Sinks are one of the most commonly used components in the electronics industry. ATS-13F-141-C1-R0 is no exception. This thermally efficient component helps to transfer heat from one place to another, keeping the temperature of the components within safe limits. First, let\'s have a look at what ATS-13F-141-C1-R0 is. This component is designed to dissipate heat energy from an electronics component or system, often referred to as a heatsink. It is made of aluminium or some alloy which is particularly effective in heat transfer. It is also easy to use, making it an ideal choice for many applications. The main application fields of ATS-13F-141-C1-R0 are in electronics; they are used in many different types of electronic devices, including but not limited to computers, televisions, gaming consoles, and mobile devices. The component is able to dissipate heat from microprocessors to help keep them cool. This helps the device to perform at higher levels and with less risk of the device overheating. The component is also used in power supplies and above board components such as transformers, regulators, and capacitors. The working principle of ATS-13F-141-C1-R0 is relatively simple. As mentioned above, these heat sinks are made of aluminium or an alloy which is particularly effective in transferring heat from a component to the component’s environment. The component itself is structurally solid, but also has many fins or ribbed structures – which help to dissipate the heat. Through these fins, the heat from the component is transferred to the environment, either through convection or radiation. In addition to dissipating heat, ATS-13F-141-C1-R0 also helps to protect the component from mechanical damage. Heat sinks also help to keep the temperature of the component within safe limits, as heat can cause the component to become unstable or even damaged. The component also helps to keep the environment cooler, as it helps to transfer heat away from the component or device. Overall, ATS-13F-141-C1-R0 is a highly efficient thermal component used in many electronic applications. Its main application fields include computers, televisions, gaming consoles, and mobile devices. The component is able to dissipate heat from these types of devices in order to keep their temperatures at safe levels, as well as protecting them from mechanical damage. The component works by transferring heat from the device to the environment, either through radiation or convection. With its ability to keep components and devices running cooler for longer, ATS-13F-141-C1-R0 is a great choice for many electronic applications.

The specific data is subject to PDF, and the above content is for reference

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