ATS-13F-147-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	13.65°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-13F-147-C3-R0 Thermal - Heat Sinks Application Field and Working Principle

Heat sinks are a key component in the design of many types of electronic equipment. The ATS-13F-147-C3-R0 heat sink has been specifically designed to be used in very high-power devices and applications. It is particularly suitable for cooling applications requiring high levels of thermal performance or long-term thermal stability.The ATS-13F-147-C3-R0 thermal - heat sink is a combination of a heatsink and a fan which are connected together. It is designed to provide efficient thermal transfer by increasing the surface area of the heatsink. The fin increases its overall surface area, thus allowing efficient heat dissipation. The fan helps accelerate air circulation, further improving its heat dissipation capabilities. The combination of the two components gives the ATS-13F-147-C3-R0 heat sink superior thermal performance over other standard heatsinks.This heat sink has many advantages when compared to traditional non-fan heat sinks. It is able to dissipate large amounts of heat relatively quickly, making it ideal for high-power applications. It is relatively lightweight, which helps with non-thermal loads. It also has excellent thermal stability, with minimal performance fluctuations even in higher temperatures. Additionally, it is constructed with a thermal dissipative material which helps to increase its longevity.The ATS-13F-147-C3-R0 heat sink is suitable for a wide range of applications, including high-power processors, CPUs, GPUs, and other high-power components. It is also used in other applications such as in electric vehicles, industrial electronics, and telecommunications. The ATS-13F-147-C3-R0 thermal - heat sink is also popular as a cooling solution for a variety of consumer electronics, such as LED and LCD displays, as well as gaming consoles.The working principle of the ATS-13F-147-C3-R0 thermal heat sink is simple. The heat produced by the electronic equipment is absorbed by the heatsink and then dissipated into the environment. The fan helps speed up the circulation of the cooled air, allowing the heat to be dissipated more quickly and efficiently.In conclusion, the ATS-13F-147-C3-R0 thermal - heat sink is an efficient cooling solution for many high power applications. It\'s lightweight design makes it suitable for non-thermal loads, and its superior thermal performance and thermal stability make it an ideal choice for a variety of cooling requirements. Additionally, its flexible mounting technology makes it easy to install and maintain, allowing for excellent reliability and longevity.

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