| Allicdata Part #: | ATS-13F-150-C3-R0-ND |
| Manufacturer Part#: |
ATS-13F-150-C3-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13F-150-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.58596 |
| 30 +: | $ 3.38646 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.95°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-Heat Sinks are a type of component used to reduce the heat generated in an operating device or system. The ATS-13F-150-C3-R0 is a heat sink designed for high-performance applications, allowing improved thermal performance and improved system reliability and robustness. This article explains the application field and working of the ATS-13F-150-C3-R0.
The ATS-13F-150-C3-R0 is a high-performance active heat-dissipation solution. It is designed to reduce thermal losses in high-powered applications such as DC/DC electronics, telecommunications, automotive, and power electronics. This heat sink also offers an optimized surface geometry, enabling increased air flow, better conduction, and improved thermal performance. In addition, the ATS-13F-150-C3-R0 provides improved thermal resistance for applications that operate in large and varying temperature or humidity ranges. The device also has the capability to use additional fans for improved cooling and even lower fan noise.
The ATS-13F-150-C3-R0 is designed to optimize air flow and surface geometry while minimizing the heat transfer coefficient. This allows thermal energy to be transferred away from the device to the air and dissipated safely and efficiently. The heat sink is also designed to be easy to install, eliminating the need for time-consuming soldering and assembly. By achieving these goals, the ATS-13F-150-C3-R0 helps reduce system failures due to thermal losses.
The ATS-13F-150-C3-R0 also helps improve system reliability by providing improved heat rejection performance. The device is designed to not only dissipate heat but also to reduce the device’s total thermal resistance. This improved heat rejection performance allows more energy to be dispersed through the heat sink, improving overall system performance.
The ATS-13F-150-C3-R0 is also designed to allow for increased air flow with minimal noise, which is ideal for applications that require noise reduction. The ability to use additional fans for even better cooling performance helps reduce stress on system components and improves overall system reliability.
Overall, the ATS-13F-150-C3-R0 is an effective heat-dissipation solution designed for high-powered applications. The optimized surface geometry allows for increased air flow, improved thermal performance, and improved system reliability. Additionally, the device allows for improved heat rejection performance, while also allowing for increased air flow with minimal noise. This makes the ATS-13F-150-C3-R0 an ideal choice for applications that need to reduce thermal losses and prevent system failures.
The specific data is subject to PDF, and the above content is for reference