| Allicdata Part #: | ATS-13F-153-C3-R0-ND |
| Manufacturer Part#: |
ATS-13F-153-C3-R0 |
| Price: | $ 3.91 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13F-153-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.55131 |
| 30 +: | $ 3.35370 |
| 50 +: | $ 3.15643 |
| 100 +: | $ 2.95917 |
| 250 +: | $ 2.76189 |
| 500 +: | $ 2.56462 |
| 1000 +: | $ 2.51530 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.06°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are pieces of equipment that are designed to absorb heat and transfer it away from fragile components such as semiconductor chips. They are an essential part of a computer’s cooling system, and often the most overlooked parts of a computer system. Understanding how they work is important in ensuring that your system is running at peak performance. The ATS-13F-153-C3-R0 Heat Sink is a cost-effective solution that provides efficient cooling and is suitable for a wide range of applications.
What are Thermal Heat Sinks?
A thermal heat sink is a device designed to transfer heat generated by an electric component or device away from it, in order to maintain its operating temperature in a safe range. The traditional heat sink is typically made of an aluminum chassis plus a large number of fins that are arranged in an array to maximize air flow, providing superior performance compared to traditional heat sinks. The ATS-13F-153-C3-R0 Heat Sink has a calculated fin diameter of 10.6 mm to maximize air flow. This is also designed to increase the natural convection heat exchange efficiency.
How Do Thermal Heat Sinks Work?
Heat sinks work by transferring the heat from an electric device or component away from it, to the fins on the heat sink. These fins are usually made from aluminum which is a good conductor of heat. As the heat is transferred to the fins, it is then cooled down by air passing over them, dissipating heat in the process. The ATS-13F-153-C3-R0 Heat Sink is designed to maximize heat transfer in two ways: by leveraging natural convection and by maximizing surface area in contact with air.
The first way of maximizing heat transfer is by leveraging convection. This is accomplished by having an open chassis and fins – the ATS-13F-153-C3-R0 heat sink has 4840 turrets or fins and an open chassis – which allows air to freely move around the fins. The air is cooled down as it passes over the heat sink\'s body and is then reheated by the components, creating natural convection. This means that as the air is continually reheated while passing over the heat sink’s body, a cycle of constant air movement is created, resulting in a more efficient heat transfer.
The second way of maximizing heat transfer is by increasing the surface area in contact with air. By increasing the number of fins or turrets and their surface area, the rate of heat transfer is increased. The ATS-13F-153-C3-R0 heat sink has 4840 turrets with a 10.6 mm diameter to maximize its surface area and thus maximize the rate of heat transfer.
Benefits and Application Field of ATS-13F-153-C3-R0 Heat Sink
The ATS-13F-153-C3-R0 heat sink is designed to be cost effective with high performance, making it suitable for a wide range of applications. It’s perfect for cooling processors, GPUs, power management ICs and other similar electronic components. It’s designed to be used with air cooling systems and can be used in highly restrictive or fanless environments. As well as improving the cooling efficiency of electronic components, the ATS-13F-153-C3-R0 heat sink also improves airflow inside the system by absorbing and dissipating heat directly from the chip’s surface.
The ATS-13F-153-C3-R0 heat sink is constructed from thermal optimized aluminum alloy for superb and efficient heat transfer and temperature regulation. It has a fin diameter of 10.6mm that allows for optimum heat transfer as well as maximum surface area in contact with air. The fins are also designed with sharp edges to reduce turbulence and improve the rate of heat transfer. The heat sink also features a clamp mechanism for easy and efficient installation into any system.
Conclusion
The ATS-13F-153-C3-R0 heat sink is a perfect solution for high performance, cost effective cooling systems. It is designed to leverage natural convection to improve heat transfer, and its 4840 turrets with 10.6mm diameter maximize surface area in contact with air. It is suitable for a wide range of applications including processors, GPUs, and power management ICs. It is also designed to be used with air cooling systems and can be used in highly restrictive or fanless environments. The ATS-13F-153-C3-R0 heat sink is an efficient and reliable solution for cooling your system, and is essential to keeping your system running at peak performance.
The specific data is subject to PDF, and the above content is for reference