| Allicdata Part #: | ATS22710-ND |
| Manufacturer Part#: |
ATS-13F-156-C2-R0 |
| Price: | $ 4.31 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13F-156-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.92112 |
| 30 +: | $ 3.70335 |
| 50 +: | $ 3.48541 |
| 100 +: | $ 3.26762 |
| 250 +: | $ 3.04978 |
| 500 +: | $ 2.83194 |
| 1000 +: | $ 2.77748 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.14°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important consideration when using components and systems in a wide variety of applications. Heat sinks are a popular solution for dissipating heat in electrical and electronic devices. The ATS-13F-156-C2-R0 is a compact, low profile package designed for thermal dissipation and thermal management. This heat sink has a number of features that make it an attractive option for a number of applications.
The ATS-13F-156-C2-R0 features a black anodized finish, which provides superior corrosion resistance and heat dissipation. The heat sink measures 103mm x 73mm x 15mm, making it a versatile option for a range of application fields. The underside of the sink features slotted mounting holes to make installation easy and simple. The heat sink also features an internal cooling fan, which helps to efficiently dissipate heat even in tight spaces.
The ATS-13F-156-C2-R0 is ideal for use in consumer electronics such as computers and laptops, as well as in industrial applications. It can be used to dissipate heat from components such as CPUs, GPUs, CPUs and other components. It is also well suited to dissipating heat generated by circuit boards and high power amplifiers. The heat sink is designed to be used in temperatures ranging from -40°C to +85°C.
The ATS-13F-156-C2-R0 works by using a combination of convection and conduction to dissipate heat. The heat is generated by the device or component being cooled, and will travel through the metal of the heat sink. The heat sink then works to transfer the heat away from the device or component and dissipate it into the surrounding air.
The necessity for efficient thermal management and heat dissipation is an ever-increasing challenge and the ATS-13F-156-C2-R0 is a popular and cost-effective solution. Its low profile, versatile design makes it suitable for a wide range of applications, and its black anodized finish provide superior corrosion resistance and superior thermal dissipation.
The specific data is subject to PDF, and the above content is for reference