| Allicdata Part #: | ATS22714-ND |
| Manufacturer Part#: |
ATS-13F-16-C2-R0 |
| Price: | $ 4.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X10MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13F-16-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.05090 |
| 10 +: | $ 3.94443 |
| 25 +: | $ 3.72506 |
| 50 +: | $ 3.50608 |
| 100 +: | $ 3.28690 |
| 250 +: | $ 3.06777 |
| 500 +: | $ 2.84864 |
| 1000 +: | $ 2.79387 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are very important components of many electronic systems due to their ability to dissipate heat away from critical components. The ATS-13F-16-C2-R0 heat sink is one of the most versatile and advanced designs on the market today. It has been designed to provide superior thermal characteristics with a minimal footprint and is suitablRead for a variety of industrial and commercial applications.
The design of the ATS-13F-16-C2-R0 allows it to be conveniently installed in most systems, regardless of its size. Its unique shape helps to reduce the amount of space that is required for installation while still delivering superior thermal performance. The ATS-13F-16-C2-R0 is made from anodized aluminum, which helps to provide increased corrosion resistance. It also has a long life span, making it an ideal solution for applications where maintenance is difficult or impossible.
The ATS-13F-16-C2-R0 utilizes a two-piece design which consists of an upper section and a lower section. The top section consists of an array of fins that are arranged in a concentric pattern to maximize heat dissipation. The fin array is held in place at the base with a silicone sheet band which allows for easy installation and removal. The upper section also includes an integrated fan to further promote air flow and cooling.
The lower section of the ATS-13F-16-C2-R0 consists of four separate layers. The first two layers are designed to provide cushioning for the components that are mounted on the heat sink. The third layer is designed to provide additional support and stability while the fourth layer is designed to provide a dielectric insulation layer. This combination of materials provides excellent performance at both low and high temperatures.
The ATS-13F-16-C2-R0 has been designed to be used in a variety of applications where high heat dissipation is required. This includes applications such as industrial PC’s, motherboard cooling, power supplies, embedded controllers, and heat spreaders. The ATS-13F-16-C2-R0 offers a unique solution that combines low profile, light weight, and an extremely low thermal resistance.
The working principle of the ATS-13F-16-C2-R0 is simple but effective. It works by absorbing the heat generated by the components that are attached to it and then transferring this heat away from the component. The heat is conducted away from the component through the heat sink\'s fins and distributed out of the heat sink\'s enclosure. This reduces the overall temperature of the components and prevents them from overheating.
The ATS-13F-16-C2-R0 is a reliable and efficient heat sink that provides superior cooling performance. It is a powerful and versatile solution for applications that require high heat dissipation and an all-in-one design. Its light weight and low profile design make it easy to install in a variety of applications, and its thermal characteristics ensure that the components will remain cool and reliable.
The specific data is subject to PDF, and the above content is for reference