| Allicdata Part #: | ATS-13F-171-C1-R0-ND |
| Manufacturer Part#: |
ATS-13F-171-C1-R0 |
| Price: | $ 3.42 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X20MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13F-171-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.11472 |
| 30 +: | $ 3.03051 |
| 50 +: | $ 2.86209 |
| 100 +: | $ 2.69375 |
| 250 +: | $ 2.52542 |
| 500 +: | $ 2.44124 |
| 1000 +: | $ 2.18870 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.28°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are an essential component of many modern electronic systems. ATS-13F-171-C1-R0 is a heat sink designed to help dissipate heat generated by electronic components, allowing them to function more efficiently and with higher levels of reliability. In this article, we will examine the application field and working principle of the ATS-13F-171-C1-R0.
The most common application for the ATS-13F-171-C1-R0 heat sink is in the cooling of PCBs (printed circuit boards). When the board is populated with electronic components, it generates heat as the electrical current passes through them. The heat sink is mounted on the board at an area with abundant airflow, and it increases the area of the board to which heat can be dissipated. By expanding the surface area of the board, more of the heat is dissipated, thus allowing the board to operate more efficiently and with greater reliability.
The ATS-13F-171-C1-R0 heat sink also works well in larger applications. It is designed to be mounted on an enclosure or housing, as this greatly increases the surface area to which the heat can be dissipated. This makes it ideal for applications such as medical and telecommunications equipment, or CCTV systems, as they generate large amounts of heat as the result of operation.
The working principle of the ATS-13F-171-C1-R0 heat sink is relatively simple. The heat sink consists of a series of fins which act to increase the surface area of the heat sink, allowing more heat to be dissipated. The fins are composed of highly conductive materials to ensure that the heat is efficiently transferred away from the board. Additionally, the heat sink is designed to be dissipative, meaning that it will draw heat away from the components even when no airflow is present.
The ATS-13F-171-C1-R0 heat sink also features an advanced mounting system which allows for easy and secure installation. The mounting system consists of clips which attach the heat sink to the board, providing a tight and secure fit. Additionally, the mounting system is designed to have minimal effect on board assembly, as there are no components which need to be soldered to the board.
In conclusion, the ATS-13F-171-C1-R0 heat sink is a robust and reliable solution for active cooling of electronic components. It is designed to be mounted on a printed circuit board, enclosure, or housing, and features a highly efficient mounting system which ensures a secure fit. Additionally, the advanced fin design allows for efficient heat transfer, ensuring that the components remain cool and functional. This makes the ATS-13F-171-C1-R0 heat sink an ideal choice for a wide range of applications.
The specific data is subject to PDF, and the above content is for reference