ATS-13F-18-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-13F-18-C3-R0-ND

Manufacturer Part#:

ATS-13F-18-C3-R0

Price: $ 4.33
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X15MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-13F-18-C3-R0 datasheetATS-13F-18-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.89781
30 +: $ 3.68151
50 +: $ 3.46487
100 +: $ 3.24834
250 +: $ 3.03178
500 +: $ 2.81523
1000 +: $ 2.76109
Stock 1000Can Ship Immediately
$ 4.33
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 13.45°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal heat sinks have become a common and reliable means of controlling extreme temperatures in many applications. They are reliable as they provide a highly efficient, cost effective solution to mitigating temperature changes that could potentially damage or disrupt the performance of a system. The ATS-13F-18-C3-R0 passive heat sink is one of the most common and popular models on the market today due to its many features and capabilities.

The ATS-13F-18-C3-R0 is designed to provide a highly efficient heat conduction solution to keep components and systems cool, working within an ambient temperature range of -20 to +85 ̊C. It is made of a high quality aluminum alloy heat sink, complete with a nickel-plated fins which helps to promote natural airflow to improve cooling and protection from external contaminants like dust. The fins are widely spaced in order to provide maximum cooling as air can circulate freely between the fins.

The heat sink also features an optimized pin-fin design that improves surface contact between the base and the fins to ensure a faster and more efficient transfer of heat away from the device. A vertical or horizontal stamped indentation provides enhanced contact between the heat sink and the device, and a PU (polyurethane) base material ensures even contact and improved performance over time.

Furthermore, the ATS-13F-18-C3-R0 is designed to provide thermal management in a wide range of applications. It is suitable for servers, automotive electronics, solar panel arrays, industrial and medical applications. It also features a low profile design, making it ideal for tight spaces or when clearance is limited.

The ATS-13F-18-C3-R0 operates on the principle of convection cooling, which works by removing heat from the device by exchange of air directly between its surface and the heat sink. As the air within the heat sink is heated by the device, it has a lower pressure and is forced to move through the fan-like fins on the top. This air is then replaced by cooler air from outside the heat sink, resulting in a continuous circulation of air passing over the device.

The heat is then absorbed by the fins, then dissipated into the surrounding external air, helping to keep temperatures under control. The efficient design of the ATS-13F-18-C3-R0 helps to ensure maximum effectiveness of the heat sink, thus providing reliable cooling and protection for both sensitive components and the system as a whole.

The ATS-13F-18-C3-R0 is a reliable, cost effective thermal-heat solution for controlling extreme temperatures in various applications. its highly efficient design ensures effective heat conduction and maximum performance, while its low profile design makes it ideal for tight spaces or limited clearance. With its nickel-plated fins and optimized pin-fin design, the heat sink ensures efficient heat dissipation and protection from contaminants, making it the ideal choice for a wide range of applications.

The specific data is subject to PDF, and the above content is for reference

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