| Allicdata Part #: | ATS-13F-186-C3-R0-ND |
| Manufacturer Part#: |
ATS-13F-186-C3-R0 |
| Price: | $ 4.43 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X35MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-13F-186-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.99042 |
| 30 +: | $ 3.76887 |
| 50 +: | $ 3.54715 |
| 100 +: | $ 3.32545 |
| 250 +: | $ 3.10376 |
| 500 +: | $ 2.88206 |
| 1000 +: | $ 2.82664 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important part of electronics design, as it is essential to be able to dissipate heat safely and effectively in order to ensure the longevity and reliability of any electronic device. Heat sinks are one of the most common methods of managing heat. Heat sinks are passive heat exchangers that transfer heat generated by an electronic device away from the device itself, to prevent it from overheating.
The ATS-13F-186-C3-R0 is a heat sink designed specifically for applications that require efficient cooling of heat-sensitive components while maintaining a minimum footprint. The ATS-13F-186-C3-R0 features a lightweight aluminum alloy heat sink that is designed to efficiently absorb and dissipate generated heat. It has an axial fin design that allows for increased air flow between the fins for superior cooling performance. The increased surface area provided by thes fins also increases the thermal interface between the heat sink and the heat-producing component, while the anodized finish provides corrosion resistance, further increasing its performance.
The ATS-13F-186-C3-R0 is primarily used in applications where the temperature needs to be kept below a certain level for the device to operate properly. This can be in applications such as telecommunications and data centers, where sensitive components and products must be kept cool to protect them from overheating and damage. Additionally, the ATS-13F-186-C3-R0 is also used in applications where the temperature of the environment needs to be controlled for the device to function properly. This can include applications such as industrial and medical products, which must be able to effectively maintain a certain temperature in order to do their job correctly.
The ATS-13F-186-C3-R0’s working principle is based on the science of thermodynamics. When a device produces heat, the heat radiates outward from the device, increasing the temperature of the surrounding environment. The heat sink’s fins absorb the heat radiation and deflect it outward into the atmosphere, maintaining a cooler internal temperature. In addition, the heat sink’s material also acts as an insulator, reducing the amount of heat transferred to the environment.
The ATS-13F-186-C3-R0 is designed to provide efficient and reliable cooling of heat-sensitive components. Its lightweight aluminum alloy heat sink is designed to absorb and dissipate heat efficiently, while the axial fin design allows for increased air flow between the fins for superior cooling performance. Additionally, the anodized finish of the heat sink provides corrosion resistance, further increasing its performance. The ATS-13F-186-C3-R0 is the ideal solution for thermal management in applications where heat must be safely and effectively dissipated.
The specific data is subject to PDF, and the above content is for reference
ATS-13F-186-C3-R0 Datasheet/PDF