| Allicdata Part #: | ATS-13F-192-C3-R0-ND |
| Manufacturer Part#: |
ATS-13F-192-C3-R0 |
| Price: | $ 4.73 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13F-192-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.25628 |
| 30 +: | $ 4.02003 |
| 50 +: | $ 3.78365 |
| 100 +: | $ 3.54715 |
| 250 +: | $ 3.31068 |
| 500 +: | $ 3.07420 |
| 1000 +: | $ 3.01508 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.43°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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At its simplest definition, a thermal heat sink is a component that is designed to absorb and dissipate heat generated from an electronic device. The ATS-13F-192-C3-R0 is a special type of thermal heat sink that is specifically designed to increase overall device performance while reducing its temperature. Not only that, but it also provides a more efficient cooling system due to its unique design.
The ATS-13F-192-C3-R0 thermal heat sink is composed of an aluminum base plate, which is combined with two low-density aluminum fins. The fins provide additional surface area for heat dissipation which helps to improve overall efficiency. Additionally, the fins help to improve the rate at which heat can be transferred from the heat sink to its surroundings. Furthermore, this type of thermal heat sink also has a tight plastic cover which helps to reduce the amount of heat being trapped.
In general, the main purpose of a thermal heat sink is to help manage the temperature of an electronic device. This is accomplished by absorbing and dissipating heat generated from the device in order to keep it at an optimal temperature level. This helps to improve the performance of the device while also protecting it from becoming too hot and potentially damaging its internal components. In the case of the ATS-13F-192-C3-R0, it is designed to help reduce the temperature of electronic devices while providing extra cooling.
The ATS-13F-192-C3-R0 thermal heat sink is used in a variety of applications, including computers, laptops, automotive electronics, and other electronic devices. It is often used in combination with a fan to provide extra cooling to the device. Additionally, it can be used in a variety of different configurations in order to maximize efficiency and cooling.
The working principle behind the ATS-13F-192-C3-R0 thermal heat sink is fairly simple. It makes use of its two low-density aluminum fins in order to increase surface area and increase heat absorption. The heat is then dissipated from the fins to the environment, which helps to keep the device at an optimal temperature. The tight plastic cover also helps to keep the heat from being trapped within the device.
Overall, the ATS-13F-192-C3-R0 thermal heat sink is an effective solution for keeping the temperatures of electronic devices under control. It is designed to increase efficiency while reducing heat generated from the device. Its unique design also helps to ensure that the heat is effectively dissipated, thus reducing the risk of it damaging the internal components.
The specific data is subject to PDF, and the above content is for reference