ATS-13F-20-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-13F-20-C3-R0-ND

Manufacturer Part#:

ATS-13F-20-C3-R0

Price: $ 4.67
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-13F-20-C3-R0 datasheetATS-13F-20-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.19895
30 +: $ 3.96543
50 +: $ 3.73225
100 +: $ 3.49896
250 +: $ 3.26570
500 +: $ 3.03243
1000 +: $ 2.97412
Stock 1000Can Ship Immediately
$ 4.67
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.21°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are used in a variety of applications to manage heat better and make sure it stays within an acceptable range. The ATS-13F-20-C3-R0 is an advanced heat sink with unique properties that set it apart from other products in the market. It is designed for use in a range of environments, including industrial, medical, and automotive applications. Here, we will discuss its application field and working principle.

The ATS-13F-20-C3-R0 is a two-phase cooling solution that provides increased cooling efficiency and reduced noise. It utilizes an advanced fan technology that ensures quiet operations, even when the system is running at high speeds. The fan is made from high-grade aluminum alloy and features an optimized thickness that allows for better heat dissipation. The ATS-13F-20-C3-R0 also has a strong and rigid frame that allows for the maximum amount of airflow to pass through its sides and dissipate the generated heat.

In addition to its optimized fan and frame, the ATS-13F-20-C3-R0 also incorporates a unique micro channel technology. This technology improves thermal performance by taking advantage of the natural air flow generated by the fan. The micro channels increase the air velocity, allowing the fans to work more efficiently and dissipate heat much quicker. This results in improved cooling performance and reduced component temperatures.

The ATS-13F-20-C3-R0 is designed for a variety of industrial, medical, and automotive applications. It is suitable for use in high power electronics, data centers, servers, and automotive applications. It can be used for cooling high-power components, such as CPUs and GPUs. It is also used in imaging systems such as medical and industrial x-ray machines. Additionally, the ATS-13F-20-C3-R0 is highly reliable and is built to last even in harsh environments.

The ATS-13F-20-C3-R0 offers a range of benefits that makes it a highly preferred choice among engineers and designers. By combining its advanced fan technology, strong frame, and micro channel technology, it is able to provide better overall cooling performance. It is able to keep components cool even in demanding environments, making it a great choice for a wide range of applications. Additionally, it is easy to install and requires low maintenance.

In conclusion, the ATS-13F-20-C3-R0 is an advanced heat sink that is designed for a range of applications. It is highly efficient and can provide improved cooling performance for components in a variety of environments. It is easy to install and is built to last in various conditions. This makes it a great choice for a wide range of industrial, medical, and automotive applications.

The specific data is subject to PDF, and the above content is for reference

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