ATS-13F-210-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.756" (70.00mm)
Width:	2.756" (70.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.472" (12.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	5.17°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction

High precision and high efficient thermal - heat sinks are substantially important for numerous applications in many industries. The ATS-13F-210-C1-R0 thermal heat sink is specifically designed to achieve optimal thermal performance and maximum reliability for a wide variety of applications. This article aims to explore the application fields and working principle of this type of thermal heat sink.

Application Fields

The ATS-13F-210-C1-R0 thermal heat sink are applicable in a broad range of applications such as laser power amplifiers, power semiconductor packages, and high power LEDs. The thermal heat sink is ideal for dissipating the heat generated during the operation of these power devices.In laser power amplifiers, heat is generated due to the interactions between electrical currents and the physical properties of the lasers and the components it is connected to. By incorporating a thermal heat sink, the generated heat can be removed effectively from these components, thus increasing the operational reliability of the laser system.In power semiconductor packages, thermal heat sinks are also used to dissipate the heat generated during operation. By securely connecting the thermal heat sink to the components, the heat generated can be effectively conducted to the heat sink and dissipated, thus keeping the components cool and efficient throughout operation.The ATS-13F-210-C1-R0 thermal heat sink is also suitable for high power LEDs. As these LEDs draw a lot of current, a significant amount of heat is generated during their operation. By incorporating thermal heat sink, the heat generated by LED can be efficiently dissipated in order to protect it from thermal damage and maximize its lifespan.

Working Principle

The ATS-13F-210-C1-R0 thermal heat sink is designed to disperse the heat from whatever device it is attached to, and thus preventing any damage to the device due to overheating. The working principle of this type of thermal heat sink is based on conduction, convection, and radiation. The components in contact with the thermal heat sink have a direct contact to the heat sink, thus facilitating thermal conduction. This thermal conduction is further enhanced by convection, which is a process by which heat is transferred by the motion of air or other gases. The radiative cooling of the ATS-13F-210-C1-R0 thermal heat sink also facilitates the removal of heat from the components, thus optimizing the thermal performance and reliability of the device.

Conclusion

From this article, we can conclude that the ATS-13F-210-C1-R0 thermal heat sink is suitable for laser power amplifiers, power semiconductor packages, and high power LEDs. The working principle of the ATS-13F-210-C1-R0 thermal heat sink is based on conduction, convection, and radiation, in order to dissipate the heat generated during the operation of the devices. With its high precision and high efficient thermal performance, this type of thermal heat sink is perfectly suited for the efficient removal of heat from these components.

The specific data is subject to PDF, and the above content is for reference