| Allicdata Part #: | ATS22774-ND |
| Manufacturer Part#: |
ATS-13F-25-C2-R0 |
| Price: | $ 6.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13F-25-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.62590 |
| 10 +: | $ 5.47092 |
| 25 +: | $ 5.16726 |
| 50 +: | $ 4.86322 |
| 100 +: | $ 4.55925 |
| 250 +: | $ 4.25530 |
| 500 +: | $ 3.95135 |
| 1000 +: | $ 3.87536 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
The ATS-13F-25-C2-R0 is a thermal – heat sink device that is designed to dissipate the heat generated by electrical devices. It is typically used in the electronics industry in applications where the heat generated by the device needs to be moved away from the component to prevent damage due to overheating. This type of device is often used in computers, power supplies, and other electronic systems.
The ATS-13F-25-C2-R0 is a convection-type thermal heat sink. It is made of aluminum and is designed to draw heat away from the component being cooled and dissipate it to the surrounding air. The heat sink has a large surface area that allows for greater thermal mass and thus more effective dissipation of heat. The heat is dissipated through the fins on the heatsink, which act like radiators and dissipate heat away from the component. The fins are designed to provide a large surface area to transfer the heat more effectively and are usually made from aluminum or copper.
The ATS-13F-25-C2-R0 uses thermal paste or pads to provide an additional thermal transfer layer between the heat sink and the component being cooled. This helps to improve the transfer of heat from the component to the heat sink. The paste or pad also helps to reduce the air pockets that can form between the component and the heat sink, which can reduce the overall efficiency of the device.
The ATS-13F-25-C2-R0 is designed to work in either an enclosed space or an open space. When used in an enclosed space, the unit is designed to draw heat away from the component and dissipate it to the surrounding air. This is done by sending the heat from the component into the air through convection. When used in an open space, the device is designed to dissipate the heat through radiation. The fins on the unit are designed to act like a radiator, which allows for the heat to be dissipated more effectively.
The ATS-13F-25-C2-R0 is a reliable and efficient heat sink device that can be used in a variety of applications. It is an ideal solution for cooling hot electronic components in a variety of systems. The large surface area of the fins allows for greater thermal mass and thus more effective heat dissipation. The use of thermal paste or pads helps to improve the transfer of heat from the component to the heatsink. In addition, the ATS-13F-25-C2-R0 can be used in either an enclosed space or an open space to dissipate heat.
The specific data is subject to PDF, and the above content is for reference