| Allicdata Part #: | ATS-13F-27-C1-R0-ND |
| Manufacturer Part#: |
ATS-13F-27-C1-R0 |
| Price: | $ 5.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13F-27-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.39028 |
| 30 +: | $ 5.09061 |
| 50 +: | $ 4.79128 |
| 100 +: | $ 4.49177 |
| 250 +: | $ 4.19232 |
| 500 +: | $ 3.89287 |
| 1000 +: | $ 3.81801 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.23°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal-Heat Sinks are devices that are used in electronic and mechanical systems to control and manage the thermal properties of the application. The ATS-13F-27-C1-R0 Heat Sink is specifically designed to dissipate heat generated from electrical components or to allow for efficient heat transfer from the components to the environment.
The ATS-13F-27-C1-R0 Heat Sink is made of aluminum alloy and has a thermal conductivity rating of approximately 9.5 W/(m-K). This rating indicates that it can effectively transfer heat throughout the device. It is designed with an innovative base architecture that effectively diffuses heat energy away from the components and into the surrounding environment. It also features an advanced fin design that increases the surface area of the heat sink and allows for greater heat dissipation.
The ATS-13F-27-C1-R0 Heat Sink can be used in a variety of applications, including computers, test and measurement equipment, telecommunications equipment, industrial controls, and military applications. It is particularly suited for applications that require a higher level of power density or a higher level of thermal efficiency than is achievable with traditional heat sinks. It can also be used in applications where low acoustic output is desired, as its design is very quiet.
The ATS-13F-27-C1-R0 Heat Sink has several features that make it ideal for use in high-power and high-temperature applications. Its lightweight and slim design allows it to be installed in tight spaces. It is also corrosion-resistant and is designed to handle high levels of vibration. Additionally, its base is designed with an array of micro-fins that help to transfer heat to the environment more effectively.
The heat sink is easy to install and use. Its design is modular, allowing it to be adapted to fit different applications and configurations. It can be installed in a variety of positions, including horizontal, vertical, and upside-down. Additionally, the heat sink can be reconfigured or replaced with a different design to meet changing application requirements.
The ATS-13F-27-C1-R0 Heat Sink is an ideal solution for applications that require efficient thermal management and high-power density. Its innovative design provides an effective and efficient method for dissipating heat, enabling components to operate at their optimal levels. Additionally, its modular design allows it to be adapted to different applications, making it an ideal choice for a wide variety of applications.
The specific data is subject to PDF, and the above content is for reference