
Allicdata Part #: | ATS-13F-32-C2-R0-ND |
Manufacturer Part#: |
ATS-13F-32-C2-R0 |
Price: | $ 5.81 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 57.9X36.83X11.43MM T766 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 5.22837 |
30 +: | $ 4.93773 |
50 +: | $ 4.64726 |
100 +: | $ 4.35683 |
250 +: | $ 4.06637 |
500 +: | $ 3.77592 |
1000 +: | $ 3.70330 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Rectangular, Fins |
Length: | 2.280" (57.90mm) |
Width: | 1.450" (36.83mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.450" (11.43mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 21.46°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal heat sinks are important components in many electronic applications, such as computers, microprocessors, and other apparatus. The ATS-13F-32-C2-R0 is a thermal heat sink that works to conduct heat away from an electronic device, allowing it to operate at peak performance without overheating. To understand the ATS-13F-32-C2-R0 and its application field and working principle, we must first understand how a thermal heat sink works.
A thermal heat sink is a device made of metal alloy that absorbs and dissipates heat away from an electronic device to prevent it from overheating. The metal alloy composition of the ATS-13F-32-C2-R0, consisting of aluminum, copper and zinc, are effective in conducting heat away from the device and into the surrounding environment. The aluminum and copper provide good electrical conductivity while the zinc improves the thermal conductivity. These metals serve to eliminate excess heat, dissipate it, and keep the device cool.
The ATS-13F-32-C2-R0 is a compact thermal heat sink, measuring 2.8 inches in length, 2.7 inches in width, and 0.9 inches in height. In addition, the ATS-13F-32-C2-R0 has a thermal resistance of 0.32°C/W, which allows the heat sink to efficiently conduct heat away from an electronic device.
The ATS-13F-32-C2-R0 is widely used in a range of applications, including computers, servers, microprocessors, routers, and industrial equipment. Its compact size makes it ideal for small and medium sized electronic devices that require efficient heat dissipation. The ATS-13F-32-C2-R0 is also commonly used in laboratories and research centers where heat dissipation is critical.
Due to its compact design, the ATS-13F-32-C2-R0 can be easily installed in confined spaces, allowing it to take up minimal space. It also has a low noise design which allows it to operate without disrupting surrounding activities. The ATS-13F-32-C2-R0 is also highly durable, and its aluminum alloy construction prevents it from corroding and makes it rust-resistant.
The ATS-13F-32-C2-R0 works by absorbing and dissipating heat away from an electronic device. It consists of a metal alloy that conducts heat away from the device and into the surrounding environment. The ATS-13F-32-C2-R0 is able to effectively conduct heat away from an electronic device due to its low thermal resistance of 0.32°C/W. The ATS-13F-32-C2-R0 is also highly durable, has a low noise design, and is compact enough to fit into tight spaces.
The ATS-13F-32-C2-R0 is an essential component in many electronic applications. It works by absorbing and dissipating heat away from the device and into the surrounding environment, allowing the device to operate at peak performance without overheating. The ATS-13F-32-C2-R0 is used in computers, servers, microprocessors, routers, laboratories, and industrial equipment.
The specific data is subject to PDF, and the above content is for reference