| Allicdata Part #: | ATS-13F-40-C1-R0-ND |
| Manufacturer Part#: |
ATS-13F-40-C1-R0 |
| Price: | $ 5.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X60.96X11.43MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13F-40-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.26302 |
| 30 +: | $ 4.97049 |
| 50 +: | $ 4.67813 |
| 100 +: | $ 4.38575 |
| 250 +: | $ 4.09336 |
| 500 +: | $ 3.80098 |
| 1000 +: | $ 3.72789 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 2.400" (60.96mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.55°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a complex process in many areas of electronics, and Heat Sinks are its major component. The ATS-13F-40-C1-R0 is a high-performance, all-aluminum Heat Sink product optimized for high-power semiconductor applications. Its application field and working principle make it an important thermal management tool for electronics cooling and temperature control.
Rational Design
The ATS-13F-40-C1-R0 aluminum heat sink has a base length of 40mm and consists of a dual-finned extrusion with an integral mounting bar. These features make the Heat Sink more effective at dissipating heat than most other products. The fins are arranged closely and with optimal angles to maximize air flow and radiation. The mounting bar is machined to provide a secure press fit for optimal thermal contact between the heat sink and the heat-generating components.
Flexible Operation
The ATS-13F-40-C1-R0 Heat Sink can be powered by 12V or 15V DC and adjusted for temperature control in the range of –40°C to +85°C. The electrical resistance of this model is extremely low, which enables the Heat Sink to passively draw heat from the components or devices and transfer it to the ambient air. The Heat Sink can be purchased in 1U to 4U sizes, depending on the application.
Application Fields
The ATS-13F-40-C1-R0 Heat Sink is suitable for use in many high-power electronics and computer applications, such as servers, networking equipment, storage subsystems, power system controllers, and processors. Its high heat transfer rate and long-term reliability make it an ideal solution for these types of applications. The Heat Sink is also used in automotive and aerospace applications.
Working Principle
The working principle of the ATS-13F-40-C1-R0 Heat Sink is based on the transfer of heat from hot surfaces to the surrounding environment. This is accomplished by using a combination of convection, radiation and conduction. Convection is the transfer of heat through hot air molecules, radiation is the transfer of heat through electromagnetic waves, and conduction is the transfer of heat through solid materials. As air passes through the Heat Sink’s fins, the fins act as a large surface area to dissipate heat, while the integral mounting bar helps to maintain thermal contact between the Heat Sink and the hot components.
Conclusion
The ATS-13F-40-C1-R0 Heat Sink is an effective thermal management tool for cooling high-power electronics and controlling temperature. Its flexible operating voltage and temperature ranges, as well as its high thermal transfer rate, make it suitable for a variety of applications. With its high manufacturability, rugged construction, and easy installation, this model is an ideal choice for most thermal management tasks.
The specific data is subject to PDF, and the above content is for reference