| Allicdata Part #: | ATS-13F-40-C3-R0-ND |
| Manufacturer Part#: |
ATS-13F-40-C3-R0 |
| Price: | $ 6.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X60.96X11.43MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13F-40-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.76009 |
| 30 +: | $ 5.44026 |
| 50 +: | $ 5.12026 |
| 100 +: | $ 4.80022 |
| 250 +: | $ 4.48021 |
| 500 +: | $ 4.16019 |
| 1000 +: | $ 4.08019 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 2.400" (60.96mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.61°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks is an important part of modern technology, and ATS-13F-40-C3-R0 is one of the most widely-used heat sink varieties available. This product is very popular in a variety of applications, from personal computers and consumer electronics to high-performance industrial systems and medical equipment.
As its name suggests, ATS-13F-40-C3-R0 utilizes a pin-fin heat sink design to dissipate heat away from its surface. This model is made of aluminum alloy and features extra-large radiating fins. The fins are evenly spaced and have a sawtooth shape to promote maximum thermal efficiency. The overall shape of the ATS-13F-40-C3-R0 model is optimized to provide low air flow resistance while still allowing plenty of space for effective cooling.
Its extensive surface area helps ATS-13F-40-C3-R0 dissipate heat effectively, but that is not its only benefit. This heat sink also has excellent heat dissipation characteristics, with minimal resistance from the air flow. This helps limit the amount of heat that is generated by the device itself, reducing the power dissipation levels and in turn, the overall power consumption. It also helps reduce any potential overheating of its components, which could lead to system failure.
In addition to being a great thermal solution, ATS-13F-40-C3-R0 is also very reliable. It features a high-quality finish, with a black and silver finish to ensure that the heat sink is resistant to corrosion. It also has a temperature-resistant Thermally Conductive Paste that helps protect against thermal stress. This paste also improves the thermal conduction of the heat sink, helping it transfer heat away from its components quickly and efficiently.
Due to its superior performance and reliability, ATS-13F-40-C3-R0 has become widely used in a variety of applications. It is particularly suitable for computing systems that require efficient heat management and dissipates heat well from high-end graphics cards, CPUs, and motherboards. It is also great for powering those systems with liquid cooling solutions, thanks to its higher thermal conductivity.
The ATS-13F-40-C3-R0 heat sink also works effectively in industrial and medical settings, where it is subject to extreme temperatures. Its aluminum-alloy construction helps it manage the thermal shock present in these types of environments, while its larger fins help it draw heat away from its components efficiently.
In short, ATS-13F-40-C3-R0 is an excellent choice for anyone looking for a reliable and efficient solution for their thermal needs. It offers an impressive combination of thermal conductivity, durability, and space efficiency, making it ideal for a wide range of applications. From gaming and medical to industrial and consumer electronics, it is a great choice for any of these needs and more.
The specific data is subject to PDF, and the above content is for reference