ATS-13F-60-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	6.50°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal-Heat Sinks ATS-13F-60-C3-R0 is a type of thermal heat sink that is designed to greatly enhance heat dissipation from a wide range of electronic components. Heat sinks are used to dissipate the heat produced by active components, such as a processor or graphics card. This process helps reduce the operating temperature of the component, which can help prolong its lifespan and prevent damage. ATS-13F-60-C3-R0 is particularly popular due to its superior thermal dissipation capacity and efficiency. The ATS-13F-60-C3-R0 thermal heat sink is engineered for efficient heat transfer, effectively transferring heat from the device into the environment, allowing for the continuous operation of the device. This heat sink is made from a special copper alloy which is specially designed to dissipate heat, providing superior thermal performance. The heat sink also features a unique “pin-fin” design which increases surface area for improved air flow and heat dissipation. The ATS-13F-60-C3-R0 thermal heat sink is suitable for a variety of applications. It is ideal for cooling processors, graphics cards, memory modules, hard drives and other electronic components that generate high amounts of heat. This heat sink can be used in a variety of computer systems and is popular amongst gaming PC enthusiasts, as it is capable of efficiently dissipating large amounts of heat. It can also be used in various types of servers, providing enhanced cooling and improved system performance.The ATS-13F-60-C3-R0 thermal heat sink is easy to install and can be mounted onto various circuit boards, using standard mounting hardware. It can also be affixed to a variety of metal surfaces, such as aluminum or steel. It is lightweight and easy to handle and features a convenient “D” shaped clip attachment system for easy installation. The ATS-13F-60-C3-R0 thermal heat sink is a highly reliable and efficient heat dissipation solution, providing superior cooling performance and enhanced system reliability. It ensures exceptional heat dissipation in a wide range of applications, from processors and graphics cards to memory modules and hard disks. This thermal heat sink is designed to provide reliable heat dissipation, superior cooling performance and maximum efficiency for many years to come.

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