| Allicdata Part #: | ATS-13F-63-C3-R0-ND |
| Manufacturer Part#: |
ATS-13F-63-C3-R0 |
| Price: | $ 4.16 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13F-63-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.78252 |
| 30 +: | $ 3.57231 |
| 50 +: | $ 3.36206 |
| 100 +: | $ 3.15195 |
| 250 +: | $ 2.94182 |
| 500 +: | $ 2.73169 |
| 1000 +: | $ 2.67917 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.42°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-13F-63-C3-R0 is one of the most widely used and most reliable thermal-heat sinks on the market. It is designed to provide the maximum reliability and temperature control in a wide variety of applications. The sink is designed to dissipate heat from the processor, GPU, memory, and other components in a computer or other electronic devices that require thermal control. The sink is also designed to reduce noise levels in areas where the device is being used, such as offices or classrooms.
The ATS-13F-63-C3-R0 uses an advanced heat-sink technology which allows for the most efficient transfer of heat away from the components. The materials used in the design of the sink are of the highest quality and are specifically chosen to ensure maximum thermal performance. The heat-sink is constructed with a combination of aluminum, copper, and steel. This combination provides a high level of thermal insulation that ensures that the device\'s temperature is maintained within the specified range.
The ATS-13F-63-C3-R0 works by utilizing an aluminum fin array. The fins are arranged in an effective manner so as to maximize the surface area available for heat dissipation. As air passes over the fins, heat is conducted away from the components and dissipated into the atmosphere. Additionally, the fins allow air to flow freely around the device, thereby increasing its cooling potential.
The ATS-13F-63-C3-R0 also features an internal fan, which is used to further increase the device\'s cooling performance. The fan is used to circulate air around the inside of the sink, allowing for more efficient heat dissipation. The fan can be set to run at various speeds depending on the requirements of the application. Additionally, the fan is designed to operate quietly, ensuring that the device does not produce significant levels of noise.
In addition to its cooling capabilities, the ATS-13F-63-C3-R0 also provides other benefits. The sink is designed to distribute heat evenly, ensuring that the device temperature remains steady and consistent. The sink also features a durable construction, making it able to withstand high temperatures and wear and tear. Finally, the sink also offers a level of flexibility. It is designed to accommodate a wide range of components, allowing for easy installation and removal.
The ATS-13F-63-C3-R0 is an excellent choice for those looking for reliable thermal management. It is designed to provide maximum reliability in a wide range of applications. The device is constructed from high-quality materials, providing a durable construction. The device also offers excellent thermal characteristics that ensure optimal cooling performance. Finally, the device is easy to install and remove, providing the flexibility necessary for many modern applications.
The specific data is subject to PDF, and the above content is for reference