| Allicdata Part #: | ATS-13F-64-C3-R0-ND |
| Manufacturer Part#: |
ATS-13F-64-C3-R0 |
| Price: | $ 4.35 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13F-64-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.92112 |
| 30 +: | $ 3.70335 |
| 50 +: | $ 3.48541 |
| 100 +: | $ 3.26762 |
| 250 +: | $ 3.04978 |
| 500 +: | $ 2.83194 |
| 1000 +: | $ 2.77748 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.49°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-13F-64-C3-R0 is an advanced heat sink device designed for efficient thermal management. It is specifically designed for use in applications where extreme thermal management is required such as high temperature electronics or medical electronics. The ATS-13F-64-C3-R0 is designed to provide high thermal performance while maintaining low noise levels.
The ATS-13F-64-C3-R0 is a multi-layer heat sink constructed of aluminum and thermally conductive material. The device consists of two layers of aluminum melted and joined to form a strong and reliable structure. On top of these layers, a layer of thermally conductive material is added which serves as the heat spreader. The thermally conductive material helps to evenly distribute the heat generated by the electronic device over a larger area, thereby improving the thermal performance.
The ATS-13F-64-C3-R0 also features an optimized fin design which helps to further increase the thermal performance. The fins are designed in such a way that they can capture and dissipate a large amount of heat from the device while also providing low-noise operation. The fins are also angled in such away that they can provide additional cooling efficiency when used in conjunction with other thermal management methods such as active air or water cooling.
In order to ensure that the ATS-13F-64-C3-R0 provides the best possible thermal performance, the device includes an integrated thermistor which monitors the temperature of the device and adjusts the fan speed accordingly. The fan speed can be adjusted manually or through the use of an optional fan control module. The fan control module allows users to adjust the fan speed in a variety of ways and can be used to optimize the performance of the device.
The ATS-13F-64-C3-R0 is an ideal solution for a wide range of applications which require reliable and efficient thermal management. It can be used in a variety of electronics and medical applications, including high temperature electronics, medical electronics, and even in military applications. The device’s ability to provide reliable and efficient thermal performance makes it a suitable choice for a variety of applications.
The specific data is subject to PDF, and the above content is for reference