| Allicdata Part #: | ATS-13F-72-C1-R0-ND |
| Manufacturer Part#: |
ATS-13F-72-C1-R0 |
| Price: | $ 4.43 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13F-72-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.99042 |
| 30 +: | $ 3.76887 |
| 50 +: | $ 3.54715 |
| 100 +: | $ 3.32545 |
| 250 +: | $ 3.10376 |
| 500 +: | $ 2.88206 |
| 1000 +: | $ 2.82664 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.09°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks play an essential role in the cooling of modern devices thanks to their ability to transfer heat from one surface to another. The ATS-13F-72-C1-R0 is a heat sink specifically designed for cooling high power electronics. It is a commercial off-the-shelf product designed for easy integration and operation with minimal specialist knowledge. The ATS-13F-72-C1-R0 keeps temperatures in the ideal range for improved performance and an increased life span of the components.
This heat sink has two primary application fields. The first and most common is to cool integrated circuits (ICs) and other power electronic components used in consumer and professional audio/video systems. This includes amplifiers, receivers, and other audio/video components that use high powered ICs. By cooling these ICs, the ATS-13F-72-C1-R0 reduces the risk of overheating, which can decrease performance or lead to component failure.
The second application is to cool medical and industrial lasers. Lasers generate a lot of heat when in use and medical lasers require a steady temperature to properly operate. The ATS-13F-72-C1-R0 ensures that the operating temperature of lasers remains in the optimal range for maximum performance and longevity.
The ATS-13F-72-C1-R0 uses a unique two-stage heat exchange process to efficiently cool its components. Its thermal cooling system uses two sets of heat pillars, each connected to an independent heat carrier. As the thermal profile of a device changes, these two thermal elements dynamically adjust the flow of heat to ensure optimal cooling. This allows the ATS-13F-72-C1-R0 to precisely regulate device temperature.
The ATS-13F-72-C1-R0 also utilizes an efficient cooling fan to increase cooling capacity. The fan operates in a two-stage operation to continually regulate the flow of air over the ICs. This regulation means that the performance and reliability of the ICs are maintained in both idle and active states, allowing the device to operate reliably and efficiently.
The ATS-13F-72-C1-R0 has been carefully designed to incorporate several important features. Its low profile design allows for easy integration into most devices, while its low resistance thermal interface allows for superior thermal conduction. Its high-speed cooling fan provides ample cooling capacity and quiet operation.
In conclusion, the ATS-13F-72-C1-R0 is a useful and efficient thermal solution for those looking to cool their high power electronics. Its two-stage heat exchange process and cooling fan make it an ideal solution for cooling both ICs and medical lasers, ensuring their optimal performance and longevity. With its low profile design and superior thermal conduction, the ATS-13F-72-C1-R0 is a great device for cooling high power electronics.
The specific data is subject to PDF, and the above content is for reference