| Allicdata Part #: | ATS22809-ND |
| Manufacturer Part#: |
ATS-13F-72-C2-R0 |
| Price: | $ 5.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13F-72-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.95810 |
| 10 +: | $ 4.82328 |
| 25 +: | $ 4.55540 |
| 50 +: | $ 4.28740 |
| 100 +: | $ 4.01946 |
| 250 +: | $ 3.75150 |
| 500 +: | $ 3.48354 |
| 1000 +: | $ 3.41655 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.11°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management of electronics components is an essential part of any electronic design. Heat generated by components due to operation must be dissipated effectively in order to ensure the reliability and longevity of the system. Heat sinks provide a means of dissipating heat away from components in order to keep them within their specified temperature range, thereby allowing them to operate as intended.
The ATS-13F-72-C2-R0 heat sink is designed to provide efficient heat dissipation in highly space-constrained applications. With its small footprint, it is one of the most suitable options for applications where space is at a premium, providing an ideal solution for cooling power semiconductor devices in consumer and telecom equipment, such as xDSL, Wi-Fi, and Switching Power Supplies. It is also suitable for cooling high-power RF amplifiers and satellites.
The ATS-13F-72-C2-R0 features a high-performing cooling structure that achieves an excellent heat-sinking capacity, and has been designed to ensure a high-reliability thermal performance. It has a unique shape, with a large-area thin sheet designed to create an effective heat dissipating environment. This design maximizes the number of extension fins and improves efficiency, resulting in higher cooling performance. The materials used are also designed to be durable and corrosion-resistant.
The ATS-13F-72-C2-R0 utilizes high-performance heat-dissipation fins in order to effectively conduct away excess heat generated by operating components. The heat-dissipation fins provides a large surface area for dissipating large amounts of heat. The fins are made of aluminum and are multilayered, and the height and thickness of each layer is optimized for efficient heat dissipation. This layered design provides several advantages, such as high conductivity and heat-sinking capacity, and an improvement in the number of temperature cycles that can be accommodated. It also allows for the heat generated by the component to be channeled away towards the heat-dissipation fins, which are designed to dissipate large amounts of heat quickly.
The ATS-13F-72-C2-R0 also features a large, robust aluminum body that is designed to provide additional support and rigidity to the heat-dissipation fins. This increases the heat-sinking capacity, ensuring that the heat generated by the component is effectively distributed and dissipated. The aluminum body is also designed to be corrosion-resistant, allowing it to perform consistently over long periods of time and reduce the need for frequent replacement.
The ATS-13F-72-C2-R0 is a highly reliable and robust thermal management solution for a wide range of applications. Its slim profile and efficient heat-dissipation capabilities make it an ideal option for space-constrained applications. With its robust construction, corrosion-resistant materials, and intelligent thermal design, the ATS-13F-72-C2-R0 is sure to provide long-lasting and reliable performance for any of your thermal management needs.
The specific data is subject to PDF, and the above content is for reference