| Allicdata Part #: | ATS-13G-10-C1-R0-ND |
| Manufacturer Part#: |
ATS-13G-10-C1-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-13G-10-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28104 |
| 30 +: | $ 3.19242 |
| 50 +: | $ 3.01505 |
| 100 +: | $ 2.83771 |
| 250 +: | $ 2.66036 |
| 500 +: | $ 2.57169 |
| 1000 +: | $ 2.30565 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are used in all sorts of electronic devices, from laptops to LED lighting to handheld devices. They play an important role in the safe operation of the device by transferring and dissipating generated heat. ATS-13G-10-C1-R0 is a type of heat sink that is often utilized in medium-power dissipating applications.
ATS-13G-10-C1-R0 is designed to be highly efficient and reliable, offering robust thermal performance for medium to high-powered devices. This heat sink is made from high quality aluminum and designed with fins that are specifically arranged to maximize the surface area exposed to ambient air. The fins are also spaced separated from each other to optimize air flow and heat dissipation. Additionally, ATS-13G-10-C1-R0 is designed to accommodate both through-hole and surface-mounted components. This makes it an ideal choice for use in electronic devices where space is an issue.
The working principle of ATS-13G-10-C1-R0 is quite simple; it works by transferring heat from the electronic device to the surrounding environment. Heat is generated in the electronic device due to the electrical current flowing through it. The heat is then transferred from the device to the heat sink via conduction or convection and finally dissipates to the environment through radiation or convection. The heat is usually dissipated via the fins in the heat sink as they are exposed to the ambient air, increasing the surface area available to dissipate the heat.
Due to its efficient design and quality materials, ATS-13G-10-C1-R0 is ideal for use in compact and medium to high-powered electronics. It is capable of transferring and dissipating significant amounts of heat, making it a reliable choice for applications where thermal performance is a must. Additionally, ATS-13G-10-C1-R0 can be used in environments with limited space as the design of the heat sink allows for both through-hole and surface-mounted component installation.
Overall, ATS-13G-10-C1-R0 is a highly efficient and reliable heat sink for medium to high-powered applications. The heat sink is designed to maximize surface area exposure to ambient air, as well as accommodate through-hole and surface-mounted components, making it ideal for environments with limited space. Thanks to its metal construction and efficient design, ATS-13G-10-C1-R0 is capable of transferring and dissipating significant amounts of heat, making it a reliable option for use in thermal management applications.
The specific data is subject to PDF, and the above content is for reference